A method of manufacturing a mechanical blind hole that can be embedded in parts

Abstract

The invention discloses a manufacturing method for a mechanical blind hole capable of being embedded with parts. The method comprises the steps: drilling a through-hole on a first sub-plate and electroplating the through-hole with hole copper; filling the hole with copper paste, grinding one side of the first sub-plate and reducing copper to realize the thickness of a copper layer to be 17+-10 microns; pasting a film on the whole side of the external layer and exposing the film; removing all of the copper layer on the other side of the first sub-plate by etching; pressing one side, with the etched copper layer, of the first sub-plate and a second sub-plate, and enabling the through-hole filled with the copper paste on the first sub-plate to be a filled blind hole; mechanically drilling the filled blind hole at definite depth, opening the filled blind hole to obtain the blind hole capable of being embedded with parts. Compared with a resin filling hole, the mechanical blind hole is capable of preventing poor contact between an plug-in corner and a hole wall; meanwhile, the poor filling hole formed by directly pressing and filling with copper paste is avoided, or the roughness of the hole wall and the copper wire of the hole opening formed by directly adopting a pressing and depth-controlled drill is avoided; and moreover, the manufacturing of the blind hole is not limited by the aspect ratio of the electroplating.

Description

technical field [0001] The invention is applied to the plug-in technology of printed circuit board blind holes, and in particular relates to a manufacturing method of high aspect ratio mechanical blind holes that can be embedded in parts. Background technique [0002] In the current printed circuit board plug-in mechanical blind hole process, the maximum depth aspect ratio of mechanical blind holes is 1:1, and the PCB manufacturing process with mechanical blind holes is: material cutting-inner layer-inner layer AOI-pressing-drilling Through hole-drilling mechanical blind hole-immersion copper-plate electrical-outer layer-outer layer AOI-post process; in this process, mechanical blind hole electroless copper plating must first ensure sufficient solution flow inside the blind hole The exchange of new and old solutions, only in this way can the resin and glass fibers in the pores be adsorbed and form enough palladium particles to benefit copper metallization. In addition, there...

AI Technical Summary

Problems solved by technology

[0002] In the current printed circuit board plug-in mechanical blind hole process, the maximum depth aspect ratio of mechanical blind holes is 1:1, and the PCB manufacturing process with mechanical blind holes is: material cutting-inner layer-inner layer AOI-pressing-drilling Through hole-drilling mechanical blind hole-immersion copper-plate electrical-outer layer-outer layer AOI-post process; in this process, mechanical blind hole electroless copper plating must first ensure sufficient solution flow inside the blind hole The exchange of new and old solutions, only in this way can the resin and glass fibers in the pores be adsorbed and form enough palladium particles to benefit copper metallization. In addition, there must be enough liquid medicine flow or vibration to discharge the gas generated by the reaction. In this reaction, all The gas produced may fill the bottom of the entire blind hole, resulting in voids in the hole, and a large number of blind holes without copper

[0003] Because the blind hole is blocked, the fluidity of the liquid at the bottom of the blind hole is poor, and the fresh liquid cannot be replenished in time. The hardware equipment of the traditional vertical electroless copper production line cannot meet the liquid exchange in the blind hole at all, so the metallization quality of the blind hole cannot be guaranteed. , From the analysis of blind hole slices, there is basically no copper plating on the bottom of the blind hole. The reason is that the mechanical blind hole is too deep, and the depth-to-aperture ratio of the blind hole (hereinafter referred to as "aspect ratio") is greater than 1:1. Vertical PTH and vertical plating production line The equipment can’t meet the demand, air bubbles are easy to hide in the blind hole, the fluidity of the bottom potion is poor, and the effect of copper sinking and electroplating is not good

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