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A method for improving poor pcb resin plug hole

A resin plug hole and bad technology, which is applied in the processing of insulating substrates/layers, printed circuits, electrical components, etc., can solve the problems of PCB resin plug holes, bad plug holes, etc., to avoid bad plug holes and avoid ink. The effect of air bubbles, increasing the angle of the scraper

Active Publication Date: 2022-04-15
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to overcome the existing technical defects and provide a method for improving PCB resin plug holes, which can avoid the problem of bad plug holes caused by copper slag, burrs and sundries, and can also be used to produce boards The expansion and shrinkage coefficient after baking is used to make the screen plate, which avoids the problem of bad plug holes caused by the offset of the screen plate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0030] This embodiment provides a method for manufacturing a circuit board, and the specific process is as follows:

[0031] (1) Cutting: Cut out the core board according to the board size 520mm×620mm, the thickness of the core board is 0.5mm, and the thickness of the outer layer of copper foil is 0.5OZ.

[0032] (2) Inner layer circuit production (negative film process): Inner layer graphics transfer, use a vertical coating machine to coat a photosensitive film on the core board, the film thickness of the photosensitive film is controlled at 8 μm, and a fully automatic exposure machine is used to 5-6 grids The exposure ruler (21-grid exposure ruler) completes the exposure of the inner layer circuit on the core board, and after development, the inner layer circuit pattern is formed on the core board; the inner layer is etched, and the inner layer circuit is etched out of the exposed and developed core board, and the inner layer The line width measurement is 3mil; the inner lay...

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Abstract

The invention discloses a method for improving PCB resin plug holes, which comprises the following steps: drilling holes on a production board, metallizing the holes through copper sinking and full board electroplating in sequence, and then carrying out controlled depth back drilling on the production board, Then the production board is subjected to sand blasting and hole counting machine to count the holes and repair the blocked holes; bake the production board, and then measure the expansion and contraction coefficient of the production board after baking; make resin plug holes according to the expansion and contraction coefficient When the screen is used, the holes on the screen correspond to the holes to be filled with resin on the production board; the holes on both sides are plugged, and the resin ink is filled in the holes on both surfaces of the production board through the screen in turn; for the production board Baking is carried out to solidify the resin ink, and then the resin ink protruding from the surface of the board is removed by a grinding plate. The method of the present invention can avoid the problem of bad hole plugging caused by copper slag, burrs and sundries, and also avoids the problems caused by the deviation of the screen by using the expansion and contraction coefficient of the production board after baking. Poor plug hole problem.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for improving PCB resin plug hole defects. Background technique [0002] In recent years, with the development of miniaturization of assembly components, the wiring density of printed circuit boards has continued to increase. The planar density of the original shrinking aperture, line width, and line spacing tends to be a bottleneck, and increasing the three-dimensional density has become a new breakthrough. point. On this basis, many customers design via holes or blind buried holes in the connection pad. The via hole is plugged, and after curing, it is ground and leveled with an abrasive belt, and the excess resin at the hole is removed, and then copper is deposited on the surface of the plug hole, the board is electrically connected, and a circuit pattern is made. [0003] There are large and small plug holes on the circuit board, and the dia...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0094H05K3/005H05K3/0055H05K2203/0126H05K2203/085
Inventor 苟成孙保玉彭卫红荣孝强
Owner SHENZHEN SUNTAK MULTILAYER PCB
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