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Cleaning composition with corrosion inhibitor

A technology of cleaning composition and corrosion inhibitor, which is applied in the direction of anti-corrosion composition, detergent composition, inorganic/elemental cleaning composition, etc., and can solve problems such as poor adhesion

Pending Publication Date: 2021-02-26
ENTEGRIS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Still, copper ions may tend to diffuse into silicon dioxide (SiO 2 ), and copper may not adhere well to silicon dioxide and other dielectric materials

Method used

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  • Cleaning composition with corrosion inhibitor
  • Cleaning composition with corrosion inhibitor
  • Cleaning composition with corrosion inhibitor

Examples

Experimental program
Comparison scheme
Effect test

example

[0096] Some example cleaning compositions may consist of (or alternatively consist essentially of) various guanidine compounds, monoethanolamine, and potassium hydroxide. See Table 1:

[0097] Table 1.

[0098]

[0099] Other example cleaning compositions may consist of (or alternatively consist essentially of) various pyrazolones, monoethanolamine, and potassium hydroxide. See Table 2:

[0100] Table 2.

[0101]

[0102] Other example cleaning compositions may consist of (or consist essentially of) 8-hydroxyquinoline, monoethanolamine, various amino acids, and potassium hydroxide. See Table 3:

[0103] table 3.

[0104]

[0105] Tables 1-3 show various cleaning compositions as described herein, as well as formulations of equivalent cleaning compositions containing equivalent alkali and other ingredients without any of the corrosion inhibitors described herein. The efficacy of each of these compositions was compared to copper etch rate and electrochemical impeda...

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PUM

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Abstract

A cleaning composition and process for cleaning an in-process microelectronic device substrate, e.g., by post-chemical mechanical polishing (CMP) cleaning, to remove residue from a surface thereof, wherein the cleaning composition may be especially effective for cleaning a substrate surface that includes exposed metal such as cobalt, copper, or both, along with dielectric or low k dielectric material, and wherein the cleaning composition includes corrosion inhibitor to inhibit corrosion of the exposed metal.

Description

technical field [0001] The following description relates to a liquid composition for cleaning a surface of a microelectronic device substrate, eg, for cleaning residues from a surface of a microelectronic device substrate, wherein the liquid composition contains a corrosion inhibitor. Background technique [0002] Microelectronic device substrates are used to fabricate integrated circuit devices. Microelectronic device substrates include substrates such as silicon wafers with highly planar surfaces. Regions of electronically functional features are added to the planar surface of the substrate by means of multiple multiple selective placement and removal steps. Features are made by selectively adding and removing electronically functional materials that exhibit insulating, conducting or semiconducting properties. These electronically functional materials are optionally placed by using processing materials including photoresists, chemical etchants, and slurries containing ab...

Claims

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Application Information

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IPC IPC(8): C11D3/00C11D3/04C11D3/28C11D3/20H01L21/02H01L21/321
CPCH01L21/02074H01L21/02071C11D7/3272C11D7/3281C11D7/3209C11D7/3218C11D2111/22C11D3/0073C11D3/044C11D3/201C11D3/2072C11D3/2075C11D3/28H01L21/02041H01L21/3212C11D7/5022C11D7/329C11D7/3245C11D7/34
Inventor D·怀特E·托马斯刘俊M·怀特王朝钰D·弗赖伊
Owner ENTEGRIS INC