Polycrystalline silicon slicing equipment capable of automatically changing tool and uniformly cutting

Abstract

The invention relates to the technical field of polycrystalline silicon slicing, and discloses a polycrystalline silicon slicing device capable of automatically changing a tool and uniformly cutting,which comprises a rack, the top of the rack is slidably connected with a pressing rod, the interior of the pressing rod is fixedly connected with a gear, the interior of the gear is fixedly connectedwith a transmission wheel, the bottom of a piston plate is movably connected with a swing plate, an air bag is slidably connected to the inner bottom of the rack, a clamping rod is fixedly connected to the left side of the air bag, a sliding rod is slidably connected to the interior of the clamping rod, and a clamping jaw is movably connected to the bottom of the sliding rod. According to the polycrystalline silicon slicing equipment capable of automatically changing the tool and uniformly cutting, a tool rest rotates to drive a cutting tool to rotate, the cutting tool drives a driving wheel to rotate, the driving wheel rotates relative to the cutting tool under the action of gear teeth on the outer side of a cam, the driving wheel drives a connecting rod to rotate, and the connecting roddrives a scraping block to slide, and through the coordinated use of the scraping block and a scraping jaw, the effect of automatically polishing the tool is achieved.

Description

technical field [0001] The invention relates to the technical field of polysilicon slicing, in particular to a polysilicon slicing device capable of automatic tool change and uniform cutting. Background technique [0002] A semiconductor is a substance whose conductivity is between an insulator and a conductor. Its conductivity is easy to control and can be used as a component material for information processing. Polysilicon is a commonly used material for manufacturing semiconductor devices. Silicon is a very hard substance. Silicon The material looks like a stone. It has to be cleaned and then heated and melted in a furnace to form a large silicon ingot, which is then finely cut into pieces with a special machine. [0003] The existing polysilicon slicing equipment is not uniform enough to slice, which leads to increased workload in the later stage. At the same time, due to the high hardness of silicon, the damage to the tool is greater during cutting, and the tool needs t...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a polysilicon slicing equipment capable of automatic tool change and uniform cutting. Not uniform enough, resulting in increased workload in the later stage. Due to the high hardness of silicon, the damage to the tool is greater during cutting, and the problem that the tool needs to be polished frequently

Images