A high power density integrated pcu module and its liquid cooling design method

A liquid cooling, power chip technology, applied in the field of high power density integrated PCU module and its liquid cooling design, can solve the problems of increasing the cost of heat dissipation, inconsistency, and deviation of the cooling liquid flow rate from the optimal value, etc., to reduce the risk of overheating, The effect of shortening the development cycle, improving efficiency or effectiveness

Active Publication Date: 2022-03-25
浙江芯丰科技有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0006] The existing liquid cooling parameter optimization is only based on the optimization design criteria of the maximum temperature and maximum pressure of the coolant limited by the junction temperature of the power chip, and the existing coolant flow rate optimization does not consider the uniqueness of the high power density integrated PCU module power chips thermal resistance characteristics, which makes the designed coolant flow rate deviate from the optimum value
If the flow rate is too high, it will increase the cost of heat dissipation; if the flow rate is too low, there will be a risk of local power chip overheating
In addition, because the difference in thermal resistance of the PCU module is not considered, the coolant flow space design inside the liquid-cooled radiator cavity is not optimized and adjusted in different areas, which will also increase the risk of local chip overheating in the module.
Therefore, the existing liquid cooling design cannot effectively deal with the inconsistent thermal resistance characteristics of the PCU module due to high power density integration, making the designed liquid cooling parameters either too stringent or too slack

Method used

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  • A high power density integrated pcu module and its liquid cooling design method
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  • A high power density integrated pcu module and its liquid cooling design method

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Embodiment Construction

[0024] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that the embodiments described here are only used for illustration, and are not intended to limit the present invention. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be understood by one of ordinary skill in the art that these specific details are not required to practice the present invention. Additionally, in some embodiments, well-known circuits, materials, or methods have not been described in detail in order to avoid obscuring the present invention.

[0025] Throughout this specification, reference to "one embodiment," "an embodiment," "an example," or "example" means that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in the present inventi...

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Abstract

Disclosed is a high power density integrated PCU module and a liquid cooling design method thereof, including a liquid cooling radiator structural design and a liquid cooling parameter optimization method. The liquid cooling design method solves the problem of overheating of local power chips inside the PCU module due to high integration of the PCU power module, and realizes optimized heat dissipation of the high power density integrated PCU module.

Description

technical field [0001] The invention relates to electronic circuits, in particular to a high power density integrated PCU module and a liquid cooling design method thereof. Background technique [0002] High integration has become the mainstream trend in the development of power control unit (PCU) modules of pure electric vehicle (electrical vehicle, EV) or hybrid electric vehicle (hybrid electrical vehicle, HEV) system power control unit (PCU). The development trend of high integration of PCU modules is mainly reflected in two aspects. One is that more circuit conversion function modules are integrated into the same module, and the other is that more components are integrated into the same module. [0003] For the PCU module of plug-in hybrid electric vehicles, more circuit conversion function modules are integrated into the same module. There are also some typical examples in the industry, such as the PCU module used by Toyota's first-generation Prius. However, when the s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20872H05K7/20927H05K7/20272H05K7/20254
Inventor 杨树张茂盛盛况
Owner 浙江芯丰科技有限公司
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