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Double-sided heat dissipation large-size chip flip packaging structure and packaging method

A double-sided heat dissipation, flip-chip packaging technology, applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problem of difficult chip heat dissipation, achieve high heat dissipation efficiency, great application value, and meet the requirements of efficient heat dissipation. desired effect

Pending Publication Date: 2021-03-05
SHANGHAI XIANFANG SEMICON CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a double-sided heat dissipation large-size chip flip-chip packaging structure and packaging method to solve the problem that the existing flip-chip soldered on the organic substrate is difficult to dissipate heat

Method used

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  • Double-sided heat dissipation large-size chip flip packaging structure and packaging method
  • Double-sided heat dissipation large-size chip flip packaging structure and packaging method
  • Double-sided heat dissipation large-size chip flip packaging structure and packaging method

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Embodiment Construction

[0061] The double-sided heat dissipation large-size chip flip-chip packaging structure and packaging method proposed by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0062]In addition, unless otherwise stated, features in different embodiments of the present invention can be combined with each other. For example, a feature in the second embodiment may be used to replace a corresponding or functionally identical or similar feature in the first embodiment, and the resulting embodiment also falls within the scope of disclosure or description of the present application....

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Abstract

The invention provides a double-sided heat dissipation large-size chip flip packaging structure and a packaging method, and the structure comprises a chip, wherein the bottom surface of which is configured to be welded with the top surface of a heat dissipation welding layer, and the heat dissipation welding layer is in heat conduction with the chip; a heat dissipation cushion block, wherein the top surface of the heat dissipation cushion block is configured to be welded with the bottom surface of the heat dissipation welding layer, and the heat dissipation cushion block and the heat dissipation welding layer conduct heat conduction; and a radiator, wherein the top surface of the radiator is configured to conduct heat with the bottom surface of the radiating cushion block.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a double-sided heat dissipation large-size chip flip-chip packaging structure and packaging method. Background technique [0002] In semiconductor flip-chip packaging, the packaging structure chip is flip-chip soldered on the organic substrate, and the back is connected to the heat dissipation cover through a thermal interface material. The top of the heat dissipation cover determines whether to increase the heat sink structure to meet greater heat dissipation requirements according to the actual heat dissipation requirements. [0003] As the size of the chip becomes larger and the power consumption is higher, the heat dissipation method of this package has the following disadvantages: First, the thermal interface material is generally an organic material with low thermal conductivity. If metal solder with high thermal conductivity is used, the back of the chip nee...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/367H01L21/48H01L21/56
CPCH01L23/3672H01L23/3675H01L23/3677H01L23/3128H01L21/563H01L21/4882
Inventor 丁飞曹立强
Owner SHANGHAI XIANFANG SEMICON CO LTD
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