A high heat dissipation laser device

A laser device, high heat dissipation technology, applied in laser parts, lasers, semiconductor lasers, etc., can solve the problem of difficult application of heat dissipation structure of laser devices, and achieve the effect of excellent heat dissipation performance, simple overall structure, and precise welding operation.

Active Publication Date: 2021-10-22
HGC (WUHAN) TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The invention provides a high heat dissipation laser device to solve the problem that the heat dissipation structure of the existing laser device makes it difficult to meet the application in the scene with higher heat dissipation requirements

Method used

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  • A high heat dissipation laser device
  • A high heat dissipation laser device
  • A high heat dissipation laser device

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Embodiment Construction

[0025] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0026] In order to solve the problem that the heat dissipation structure of the existing laser device makes it difficult to meet the application in the scene with higher heat dissipation requirements, the present invention provides a laser device with a new packaging structure, which makes the laser device have a higher High thermal performance. see Figure 1-3 as shown, figure 1 A schematic top view structure diagram of a high heat dissipation laser device 100 provided by an embodiment of the present invention, figure 2 for figure 1 A schematic cross-sectional view along the A-A dire...

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Abstract

The present invention relates to the field of laser devices, and provides a high heat dissipation laser device. The laser device includes a substrate, the substrate has a first surface and a second surface oppositely arranged, the substrate is provided with at least one accommodation groove penetrating the substrate, and the accommodation groove It includes a groove wall, the end of the groove wall close to the first surface is recessed to form a first positioning step; the laser device also includes a laser chip housed in the receiving groove and a metal radiator electrically connected to the non-light-emitting surface of the laser chip; the first The positioning step is used to support and fix the laser chip, and the light-emitting surface of the laser chip faces the second surface; the end of the metal radiator close to the laser chip is accommodated in the receiving groove between the plane where the first surface is located and the non-light-emitting surface of the laser chip. inside the space. The high heat dissipation laser device of the present invention can realize that the heat generated when the laser chip is working can be directly exported through the metal heat sink without passing through other media for heat dissipation, so it has relatively excellent heat dissipation performance.

Description

technical field [0001] The invention relates to the field of laser devices, more specifically, to a high heat dissipation laser device. Background technique [0002] High-power semiconductor lasers have high output power and small light-emitting area, and they generate high heat density during operation. When the chip is overheated, the laser is quenched, which will limit the high-power laser output. Good device heat dissipation depends on optimized heat dissipation structure design, packaging material selection (thermal interface material and substrate material), and packaging manufacturing process. At present, the heat dissipation structure of the existing laser device makes there are multiple layers of media between the laser chip and the heat sink, which will reduce the heat dissipation effect, and it is difficult to meet the application in the scene with higher heat dissipation requirements. Therefore, it is urgent to provide a new heat dissipation structure to improve...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/024H01S5/0232
CPCH01S5/02469
Inventor 李坤孙雷蒙杨丹
Owner HGC (WUHAN) TECH CO LTD
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