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Liquid cooling system and electronic equipment

A liquid cooling and rehydration technology, applied in electrical digital data processing, instruments, digital data processing components, etc., can solve the problem of reducing the use time of the working medium, and achieve the effect of reducing maintenance costs and improving maintainability.

Active Publication Date: 2021-03-16
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of this application is to provide a liquid cooling system and electronic equipment to solve the problem that the working medium of the existing liquid cooling system gradually decreases with the use of time

Method used

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  • Liquid cooling system and electronic equipment
  • Liquid cooling system and electronic equipment
  • Liquid cooling system and electronic equipment

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Embodiment Construction

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application.

[0041] With the development and maturity of the chip technology, in the laptop (Laptop), the processing capabilities of components such as CPU and GPU are also gradually enhanced. Correspondingly, these components will also generate more heat during operation, and make the temperature of the notebook computer rise. It should be understood that if the heat generated by the CPU, GPU and other components is not taken away in time, the overall temperature of the notebook computer will rise rapidly, affecting the user experience; in addition, the notebook computer is also prone to frequency reduction. , downtime and other issues; in some extreme cases, it may also cause the laptop to burn down.

[0042] Based on this, the notebook computer may be equipped with a h...

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Abstract

The invention discloses a liquid cooling system and electronic equipment. The liquid cooling system comprises a heat dissipation main body and a liquid supplementing connector which are communicated;the liquid supplementing connector comprises a connector front cover, a shell, an elastic piece and a needle valve. The connector front cover is connected with the heat dissipation main body and the shell; the shell is provided with a first channel and a second channel which are communicated, and the first channel is communicated with the heat dissipation main body; a limiting face is arranged onthe inner wall of the shell and located at the junction of the first channel and the second channel. The needle valve comprises a shielding plate and a first valve body, and the shielding plate is located in the first channel and abuts against the elastic piece; the first valve body is mounted in the second channel and is provided with a liquid supplementing channel; the elastic piece is located in the first channel, the two ends of the elastic piece abut against the connector front cover and the shielding plate correspondingly, the shielding plate abuts against the limiting face, and the shielding plate separates the liquid supplementing channel from the first channel; and under the action of external force, the baffle plate leaves the limiting surface, and the liquid supplementing channel communicates with the first channel to replace the working medium.

Description

technical field [0001] The present application relates to the technical field of liquid cooling systems, in particular to a liquid cooling system and electronic equipment. Background technique [0002] In existing electronic devices such as notebook computers, components such as a central processing unit (CPU, Central Processing Unit) and a graphics processing unit (GPU, Graphics Processing Unit) obtain a higher clock frequency, and at the same time, their calorific value also increases dramatically. However, the cooling method relying on the heat sink cannot dissipate the heat of these components well, which affects the performance release of the notebook computer and reduces the user experience. In this regard, the notebook computer is integrated with a liquid cooling system to improve the heat dissipation performance of the notebook computer as much as possible through the flow of working fluid. However, the working fluid in the liquid cooling system will gradually evapo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20G06F1/203Y02D10/00
Inventor 罗洋刘涛甄海涛陈奇
Owner HUAWEI TECH CO LTD