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Silicon-modified waterborne epoxy resin emulsion and preparation method thereof

A water-based epoxy resin and epoxy resin technology, used in epoxy resin coatings, coatings, anti-corrosion coatings, etc., can solve the problem of paint film bubbling, reduce paint film water resistance, salt spray resistance, adhesion, peeling, etc. problems, to achieve the effect of enhancing adhesion, improving cross-linking density, and improving water resistance

Active Publication Date: 2021-03-19
三棵树(上海)新材料研究有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These emulsifiers remaining in the paint film will reduce the water resistance, salt spray resistance and adhesion of the paint film, which will directly cause problems such as bubbling and peeling of the paint film

Method used

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  • Silicon-modified waterborne epoxy resin emulsion and preparation method thereof
  • Silicon-modified waterborne epoxy resin emulsion and preparation method thereof
  • Silicon-modified waterborne epoxy resin emulsion and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] The silicon-modified water-based epoxy resin emulsion described in this application is mainly prepared from epoxy adducts, epoxy resins, co-solvents and water according to the mass ratio of 0.15:1:0.15:0.8;

[0051] Wherein, the molecular structure of the epoxy adduct has the molecular structure characteristics of (a) and (b):

[0052] (a) is an epoxy-terminated molecule comprising a siloxy group;

[0053] (b) is a terminal epoxy molecule comprising a polyether segment;

[0054] The polyether segment in (b) is at least one polyethylene glycol molecule with a molecular weight of 4000.

[0055] The structure of the epoxy adduct is the general formula (I), wherein, in the general formula, n is an integer of 0 or 1-10, and m is an integer of 50-250;

[0056] The epoxy adduct is mainly prepared from a silane coupling agent, a hydrophilic polyether polyol, a catalyst and an epoxy resin in a mass ratio of 0.08:2.8:0.003:1.

[0057] The epoxy resin in the epoxy adduct compon...

Embodiment 2

[0069] The silicon-modified water-based epoxy resin emulsion described in this application is mainly prepared from epoxy adducts, epoxy resins, co-solvents and water according to the mass ratio of 0.12:1:0.1:0.6;

[0070] Wherein, the molecular structure of the epoxy adduct has the molecular structure characteristics of (a) and (b):

[0071] (a) is an epoxy-terminated molecule comprising a siloxy group;

[0072] (b) is a terminal epoxy molecule comprising a polyether segment;

[0073] The polyether segment in (b) is at least one polyethylene glycol molecule with a molecular weight of 6000.

[0074] The structure of the epoxy adduct is general formula (II), wherein, n in the general formula is 0 or an integer of 1-10, and m is an integer of 50-250.

[0075] The epoxy adduct is mainly prepared from a silane coupling agent, a hydrophilic polyether polyol, a catalyst and an epoxy resin in a mass ratio of 0.1:0.8:0.0025:1.

[0076] The epoxy resin in the epoxy adduct component a...

Embodiment 3

[0088] The silicon-modified water-based epoxy resin emulsion described in this application is mainly prepared from epoxy adducts, epoxy resins, co-solvents and water according to the mass ratio of 0.12:1:0.1:0.6;

[0089] Wherein, the molecular structure of the epoxy adduct has the molecular structure characteristics of (a) and (b):

[0090] (a) is an epoxy-terminated molecule comprising a siloxy group;

[0091] (b) is a terminal epoxy molecule comprising a polyether segment;

[0092] The polyether segment in (b) is at least one polyoxyethylene monomethyl ether molecule with a molecular weight of 6000.

[0093] The structure of the epoxy adduct is general formula (III), wherein, n in the general formula is 0 or an integer of 1-10, and m is an integer of 50-250.

[0094] The epoxy adduct is mainly prepared from a silane coupling agent, a hydrophilic polyether polyol, a catalyst and an epoxy resin in a mass ratio of 0.01-0.5:0.8:0.0025:1.

[0095] The epoxy resin in the epoxy...

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Abstract

The invention relates to polysiloxane-modified waterborne epoxy resin emulsion and a preparation method thereof. The polysiloxane-modified waterborne epoxy resin emulsion is mainly prepared from an epoxy adduct, epoxy resin, a cosolvent and water in a mass ratio of (0.1-0.2): 1: (0.1-0.2): (0.6-1). The molecular structure of the epoxy adduct has the molecular structure characteristics of (a) and (b) at the same time, wherein (a) is a terminal epoxy group molecule containing a siloxy group, and (b) is a terminal epoxy group molecule comprising a polyether segment. According to the silicon-modified waterborne epoxy resin emulsion and the preparation method thereof of the invention, the adhesive force, water resistance, salt spray resistance and other properties of an existing water-borne epoxy resin emulsion are improved; the epoxy adduct (emulsifier) with an organosilicon structure is synthesized through a chemical modification process; and the organosilicon structure with excellent adhesive force and strong hydrophobicity is introduced into a crosslinking system of a paint film, and therefore, the adhesive force, the water resistance and the salt fog resistance of the paint film are improved.

Description

technical field [0001] The application relates to a silicon-modified water-based epoxy resin emulsion and a preparation method thereof, which are applied in the production field of metal anti-corrosion coatings. Background technique [0002] As one of the three general-purpose thermosetting resins, epoxy resin has excellent process performance, mechanical properties and physical properties, and is widely used in metal anti-corrosion coatings. In order to avoid a large amount of alcohol, ether and ketone organic solvents that pollute the environment during the construction of traditional epoxy resin anti-corrosion coatings, water-based epoxy resins and related coating products have been developed in recent years to replace traditional high-pollution Solvent-based epoxy anti-corrosion coating. [0003] In the known relevant bibliographical reports (such as CN 108084458 A, CN110577652 A, CN 106349906 A) of preparing water-based epoxy resin emulsion, its technology is to use ep...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D163/00C09D5/08C09D7/65C09D7/20C08G81/00
CPCC09D163/00C09D5/08C09D7/65C09D7/20C08G81/00C08G2150/90C08L87/005
Inventor 陈勇刘杰李业涛越爽付绍祥
Owner 三棵树(上海)新材料研究有限公司