Silicon-modified waterborne epoxy resin emulsion and preparation method thereof
A water-based epoxy resin and epoxy resin technology, used in epoxy resin coatings, coatings, anti-corrosion coatings, etc., can solve the problem of paint film bubbling, reduce paint film water resistance, salt spray resistance, adhesion, peeling, etc. problems, to achieve the effect of enhancing adhesion, improving cross-linking density, and improving water resistance
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Embodiment 1
[0050] The silicon-modified water-based epoxy resin emulsion described in this application is mainly prepared from epoxy adducts, epoxy resins, co-solvents and water according to the mass ratio of 0.15:1:0.15:0.8;
[0051] Wherein, the molecular structure of the epoxy adduct has the molecular structure characteristics of (a) and (b):
[0052] (a) is an epoxy-terminated molecule comprising a siloxy group;
[0053] (b) is a terminal epoxy molecule comprising a polyether segment;
[0054] The polyether segment in (b) is at least one polyethylene glycol molecule with a molecular weight of 4000.
[0055] The structure of the epoxy adduct is the general formula (I), wherein, in the general formula, n is an integer of 0 or 1-10, and m is an integer of 50-250;
[0056] The epoxy adduct is mainly prepared from a silane coupling agent, a hydrophilic polyether polyol, a catalyst and an epoxy resin in a mass ratio of 0.08:2.8:0.003:1.
[0057] The epoxy resin in the epoxy adduct compon...
Embodiment 2
[0069] The silicon-modified water-based epoxy resin emulsion described in this application is mainly prepared from epoxy adducts, epoxy resins, co-solvents and water according to the mass ratio of 0.12:1:0.1:0.6;
[0070] Wherein, the molecular structure of the epoxy adduct has the molecular structure characteristics of (a) and (b):
[0071] (a) is an epoxy-terminated molecule comprising a siloxy group;
[0072] (b) is a terminal epoxy molecule comprising a polyether segment;
[0073] The polyether segment in (b) is at least one polyethylene glycol molecule with a molecular weight of 6000.
[0074] The structure of the epoxy adduct is general formula (II), wherein, n in the general formula is 0 or an integer of 1-10, and m is an integer of 50-250.
[0075] The epoxy adduct is mainly prepared from a silane coupling agent, a hydrophilic polyether polyol, a catalyst and an epoxy resin in a mass ratio of 0.1:0.8:0.0025:1.
[0076] The epoxy resin in the epoxy adduct component a...
Embodiment 3
[0088] The silicon-modified water-based epoxy resin emulsion described in this application is mainly prepared from epoxy adducts, epoxy resins, co-solvents and water according to the mass ratio of 0.12:1:0.1:0.6;
[0089] Wherein, the molecular structure of the epoxy adduct has the molecular structure characteristics of (a) and (b):
[0090] (a) is an epoxy-terminated molecule comprising a siloxy group;
[0091] (b) is a terminal epoxy molecule comprising a polyether segment;
[0092] The polyether segment in (b) is at least one polyoxyethylene monomethyl ether molecule with a molecular weight of 6000.
[0093] The structure of the epoxy adduct is general formula (III), wherein, n in the general formula is 0 or an integer of 1-10, and m is an integer of 50-250.
[0094] The epoxy adduct is mainly prepared from a silane coupling agent, a hydrophilic polyether polyol, a catalyst and an epoxy resin in a mass ratio of 0.01-0.5:0.8:0.0025:1.
[0095] The epoxy resin in the epoxy...
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