Etching device for fine circuit

Abstract

The invention relates to an etching device for a fine circuit and belongs to the technical field of circuit board manufacturing. The etching device comprises an etching spraying disc and a bearing plate, wherein the bearing plate bears a product below the product, the etching spraying disc is arranged above the product, the etching spraying disc is composed of multiple rows of etching nozzles, thenozzles of the etching spraying disc continuously spray etching liquid to the product below at a certain pressure for etching, and a baffle is arranged above the front end of the product in the advancing direction; the baffle plate is arranged at the front end of the etching spray disc, the bottom of the baffle plate is provided with a spoiler, the baffle plate prevents spray liquid medicine fromsplashing to a pretreatment surface of a product, and the spoiler prevents the liquid medicine from flowing back to the pretreatment surface of the product. The etching device is advantaged in that the etching liquid can be effectively prevented from being contacted with the pretreatment surface of the product too early due to sputtering and backflow, and a surface state of the product is changed, so etching precision of a circuit is ensured; the influence of the pool effect on the line precision can be effectively reduced or reduced, and the waste of the etching liquid and the pollution to the liquid medicine of the next treatment tank are avoided.

Description

Technical field [0001] The present invention relates to an etching apparatus of a fine line, belonging to the field of wire board manufacturing technology. Background technique [0002] In recent years, electronic products have become small and thin, based on this trend, electronic components and their carriers have to further high refinement and precision, which also makes it directly to become the accuracy of the Bonding IC. taller and taller. The manufacturing process of COF is similar to the traditional circuit board process. It is usually applying a layer of photoresist on the substrate, and the photoresist is exposed, and the copper surface that needs to be removed, and the drug treatment is treated by special etching. The copper etching of the scored removed, and finally the remaining photoresist is pertocized, and finally get the required line. However, the routes required for COF are more refined than traditional circuit boards, so the production of each process is more ...

AI Technical Summary

Problems solved by technology

However, since the etchant is sprayed out at a certain pressure by spraying, salt mist will be generated when the etchant is sprayed out. In addition, because the product is etched horizontally, the etching solution sprayed on the product will flow back, which will also cause the product to come into contact with the etching solution in the empty delivery area, and the product will come into contact with the etching solution salt mist or etching solution before spray etching Will affect the surface state of the product, resulting in abnormal subsequent etching

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