The invention discloses a production method of a multilayer
printed circuit board. The method specifically comprises the steps of S1, preparing an inner-layer board; S2, carrying out surface treatmenton the inner-layer board; S3, preparing a prepreg; S4, superposing the inner-layer board and the prepreg through a laminating
machine, and then laminating the inner-layer board and the prepreg; S5, conducting drilling and
copper deposition, enabling the laminated circuit board to be sequentially subjected to the procedures of drilling, deburring,
photoresist residue removal, chemical
copper deposition and
electroplating, and communicating the upper inner-layer board and the lower inner-layer board; S6, preparing an outer-layer board; S7, carrying out wet ink character printing by adopting full-automatic equipment; and S8, carrying out size, surface defect and electrical property detection on the
printed circuit board product, and packaging the qualified product. According to the invention, the inner-layer board is produced by a subtracting method, the outer-layer board is produced by an addition method, the two methods are combined, the production efficiency can be greatly improved, and by improving and optimizing the
reagent formula of the prepreg and the
surface structure of the inner-layer board, the
physical performance of the prepreg is improved, the strength of the multilayer circuit board is improved, and looseness is avoided.