Production method of multilayer printed circuit board

Abstract

The invention discloses a production method of a multilayer printed circuit board. The method specifically comprises the steps of S1, preparing an inner-layer board; S2, carrying out surface treatmenton the inner-layer board; S3, preparing a prepreg; S4, superposing the inner-layer board and the prepreg through a laminating machine, and then laminating the inner-layer board and the prepreg; S5, conducting drilling and copper deposition, enabling the laminated circuit board to be sequentially subjected to the procedures of drilling, deburring, photoresist residue removal, chemical copper deposition and electroplating, and communicating the upper inner-layer board and the lower inner-layer board; S6, preparing an outer-layer board; S7, carrying out wet ink character printing by adopting full-automatic equipment; and S8, carrying out size, surface defect and electrical property detection on the printed circuit board product, and packaging the qualified product. According to the invention, the inner-layer board is produced by a subtracting method, the outer-layer board is produced by an addition method, the two methods are combined, the production efficiency can be greatly improved, and by improving and optimizing the reagent formula of the prepreg and the surface structure of the inner-layer board, the physical performance of the prepreg is improved, the strength of the multilayer circuit board is improved, and looseness is avoided.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a production method of a multilayer printed circuit board. Background technique [0002] Printed circuit board, also known as printed circuit board, is a provider of electrical connections for electronic components. Its development has a history of more than 100 years. Its design is mainly layout design. The main advantage of using circuit boards is that it greatly reduces wiring and Assembly errors have improved the automation level and production labor rate. According to the number of layers of circuit boards, they can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer boards. In the past ten years, China's printed circuit boards The board manufacturing industry is developing rapidly, and its total output value and total output both rank first in the world. Due to the rapid development of ...

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a kind of multilayer printed circuit board production method, to solve the existing multilayer printed circuit board proposed in the above-mentioned background technology that strength is low, easily loose between layers, and production efficiency is relatively low. low problem