Chemical granulation processing method for quartz surface

A rough treatment and surface chemical technology, applied in the field of quartz component processing, can solve the problems of damage and affect the dimensional accuracy of quartz products, and achieve the effects of improving growth quality, reducing deposition film shedding, and reducing cleaning frequency.

Inactive Publication Date: 2009-02-18
SHENYANG HANKE SEMICON MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a method for chemically roughening the surface of quartz, which solves the defects in the prior art that are easy to cause damage to the surface of quartz and affect the dimensional accuracy of quartz products. The design of the treatment process is reasonable and the equipment is simple. Easy to operate, the surface roughness of the obtained quartz products is uniform, and it is not affected by its shape

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0017] The preparation steps of the used treatment solution are as follows: first select the analytical pure hydrofluoric acid with a solution concentration of 40% and the solid analytical pure ammonium fluoride with a solution concentration of 99% to mix, then add the analytical pure acetic acid with a solution concentration of 99.5% to configure the treatment solution liquid for use. The mass ratio of raw materials used in the above treatment liquid is: hydrofluoric acid: ammonium fluoride: acetic acid = (2-6): (4-7): (8-11). It is advisable to use the amount of the above-mentioned treatment liquid to completely submerge the quartz product.

[0018] The reaction principle is: the main component of quartz is silicon dioxide (SiO 2 ), the quartz product is completely immersed in the configured solution and the reaction is as follows:

[0019] 6HF+SiO2 2 =H 2 SiF 6 +2H 2 o

[0020] h 2 SiF 6 =2H + +SiF 6 2-

[0021] NH 4 F=NH 4 + +F -

[0022] SiF 6 2 -+2NH ...

Embodiment 1

[0030] 1. Preparation of treatment solution:

[0031] Step 1: Under normal temperature and normal pressure, take the analytically pure hydrofluoric acid with a solution concentration of 40%, the solid analytically pure ammonium fluoride with a solution concentration of 99%, and the analytically pure acetic acid with a solution concentration of 99.5%. The ratio of hydrofluoric acid: ammonium fluoride: acetic acid=2:5:9 is selected.

[0032] Step two:

[0033] ① Mix hydrofluoric acid and ammonium fluoride first;

[0034] ② Add acetic acid and mix.

[0035]2. Put the nozzle of the quartz product into the above solution, take it out after two hours of reaction, and wash the attachment on the surface of the nozzle of the quartz product with deionized water for 15 minutes each time. After continuing to repeat the above steps twice, the surface roughness of the nozzle of the quartz product is uniform and opaque by visual inspection, and the actual surface roughness R a = 2.1 μm. ...

Embodiment 2

[0038] 1. Solution preparation:

[0039] Step 1: Under normal temperature and normal pressure, take the analytically pure hydrofluoric acid with a solution concentration of 40%, the solid analytically pure ammonium fluoride with a solution concentration of 99%, and the analytically pure acetic acid with a solution concentration of 99.5%. The ratio of hydrofluoric acid: ammonium fluoride: acetic acid = 6:7:8 is selected.

[0040] Step two:

[0041] ① first mix hydrofluoric acid and ammonium fluoride

[0042] ②Add acetic acid.

[0043] 2. Put the quartz tube into the prepared solution to participate in the reaction, take it out after two hours, and wash it with deionized water. After repeating this step three times, the surface roughness of the quartz tube was visually observed to be uniform and opaque. Measured surface roughness R a = 4.3 μm. It has been tested that the treated quartz tube can be reused and cleaned at least 4 times, and the deposition layer is effectively...

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Abstract

A method for chemically and roughly treating a quartz surface overcomes the defects of the prior art in which the treatment to the quartz surface easily leads to damage and influences the size accuracy of the quartz product. The method is as below: at a normal temperature and a normal pressure, immersing a quartz product into a container filled with a treating fluid so as to undergo reaction after the surface of the quartz product is polished, taking out the quartz product after two-hour reaction, and immersing the quartz product into the treating fluid again so as to repeat the preceding reaction till the roughness Ra of the surface of the quartz product is equal to 1.5 micrometers to 4.5 micrometers after attachments on the surface of the quartz product is eliminated with deionized water. The treatment process has reasonable design, involves simple devices and is easy to be operated, and the obtained quartz product has uniform surface roughness which is free from the influence of the shape. During the participation in the CVD reaction, the crazing and the shedding of a deposited film on the quartz surface is effectively reduced so as to reduce the possibility of pollution to the reaction cavity, to remarkably improve the finished product rate and the production efficiency, and then further to prolong the service life of the quartz product, save time, reduce consumption and reduce production cost.

Description

technical field [0001] The invention relates to a processing method for quartz components used in the semiconductor production industry, in particular to a method for chemically roughening the surface of quartz. The surface roughness of the quartz product treated by this method is more uniform, without obvious unevenness, which avoids the phenomenon of particles on the quartz surface during the chemical vapor deposition (CVD) process, prevents the generation and shedding of cracks in the deposited film, and prolongs the life of the quartz product. service life. Background technique [0002] At present, most of the quartz surface treatment technologies widely used in the semiconductor quartz processing industry are sand blasting or fire polishing. Sand blasting is a method that uses high-speed airflow to carry diamond abrasive grains to hit the quartz surface to make the quartz produce a rough (concave-convex) surface. The blasted quartz surface is roughened to attract and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C15/00C03C19/00
Inventor 米山
Owner SHENYANG HANKE SEMICON MATERIALS
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