Diode production packaging equipment with dust removal mechanism

A technology for packaging equipment and diodes, which is applied in the directions of removing smoke and dust, cleaning methods and utensils, and cleaning methods using gas flow. , the effect of reducing the defective rate

Inactive Publication Date: 2021-03-19
湖南奕瀚电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is: in order to solve the problem that the existing packaging equipment for diode production is easy to enter dust when packaging, and the sensitivity of dust is easily reduced when it is packaged into the diode, so that the d

Method used

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  • Diode production packaging equipment with dust removal mechanism
  • Diode production packaging equipment with dust removal mechanism
  • Diode production packaging equipment with dust removal mechanism

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[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that ...

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Abstract

The invention discloses diode production packaging equipment with a dust removal mechanism, and relates to the field of diode packaging. The diode production packaging equipment comprises an equipmentmain body, a mounting frame penetrates through the interior of the equipment main body, and a conveying crawler belt is mounted on the inner side of the mounting frame. After plastic package, when the diode is transmitted to a certain degree, the first wedge block contacts with the second wedge block, and the second wedge block extrudes the first wedge block, so that the ejector rod pushes the ejector plate to move up and down, the spring contracts, the ejector plate moves upwards to push the diode, and the diode is prevented from adhering to the bracket. When the first wedge-shaped block andthe second wedge-shaped block are contacted to a certain degree, the first wedge-shaped block is separated from the second wedge-shaped block, so that the top plate moves downwards to reset under thereset action of the spring, and when the bracket is transported to a certain degree, the bracket can be turned over, so that the diode can be turned over. And therefore, the diodes are separated fromthe bracket, the diodes are convenient to collect, and the working efficiency is improved.

Description

technical field [0001] The invention relates to the field of diode packaging, in particular to packaging equipment with a dust removal mechanism for diode production. Background technique [0002] A diode is a device with two electrodes among electronic components. The most common function is to only allow current to pass in a single direction (called forward bias), and block it when it is reversed (called reverse bias). The current directionality of the diode is usually called the "rectification" function, and the varactor diode is used as an electronic adjustable capacitor, so the diode can be thought of as an electronic version of the check valve, the most common diode today Most of them use semiconductor materials such as silicon or germanium. The diode needs to be plastic-packed during production, so that the internal frame, chip, soldering piece and other circuits of the diode are all encapsulated in one piece and isolated from the outside world. The material used for ...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/56B08B5/04B08B15/02
CPCB08B5/043B08B15/02H01L21/56H01L21/67121
Inventor 吴小江
Owner 湖南奕瀚电子科技有限公司
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