Device for self-assembling semiconductor light-emitting diodes

A technology of light-emitting diodes and semiconductors, applied in semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve problems such as insufficient research on manufacturing display technology, achieve self-assembly output, low cost, correct warping The effect of curvature

Pending Publication Date: 2021-03-19
LG ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Recently, U.S. Patent No. 9,825,202 discloses a microLED structure suitable for self-assembly, but insufficient research has been done on the technology of manufacturing displays through self-assembly of microLEDs

Method used

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  • Device for self-assembling semiconductor light-emitting diodes
  • Device for self-assembling semiconductor light-emitting diodes
  • Device for self-assembling semiconductor light-emitting diodes

Examples

Experimental program
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Embodiment Construction

[0053] Description will now be given in detail according to the exemplary embodiments disclosed herein with reference to the accompanying drawings. For the sake of brief description with reference to the drawings, the same or equivalent components may be provided with the same or similar reference numerals, and description thereof will not be repeated. Generally, suffixes such as "module" and "unit" may be used to refer to elements or components. The use of such suffixes herein is only intended to facilitate the description of the specification, and the suffixes themselves are not intended to give any special meaning or function. In the present disclosure, for the sake of brevity, the contents that are known to those of ordinary skill in the related art are generally omitted. The accompanying drawings help to easily understand various technical features, and it should be understood that the embodiments presented herein are not limited by the accompanying drawings.

[0054] I...

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Abstract

The present disclosure provides a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magneticfield forming part having magnets for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a horizontal moving part for changing positions of the magnet so that the semiconductor light-emitting diodes move in the fluid; a substrate chuck having a substrate support part configured to support a substrate, a vertical moving part for lowering the substrate sothat one surface of the substrate is in contact with the fluid in a state in which the substrate is supported, and an electrode connection part for applying power to the assembly electrode to generate an electric field so that the semiconductor light-emitting diodes are placed at predetermined positions of the substrate in a process of moving the semiconductor light-emitting diodes by a positionchange of the magnets; and a controller for controlling a movement of the magnetic field forming part and the substrate chuck, wherein the controller controls a depth at which the substrate is submerged in the fluid based on a degree of warping of the substrate.

Description

technical field [0001] The present disclosure relates to a method for manufacturing a display device, and more particularly, to a device for self-assembling microLEDs. Background technique [0002] In recent years, in the field of display technology, liquid crystal displays (LCDs), organic light emitting diode (OLED) displays, microLED displays, and the like have entered the fray to realize large-area displays. [0003] Meanwhile, semiconductor light-emitting diodes (microLEDs (μLEDs)) with diameters or cross-sectional areas less than 100 micrometers can offer very high efficiency when used in displays, since displays do not require polarizers to absorb light. However, large displays require millions of semiconductor light-emitting diodes, which makes device transfer difficult compared to other technologies. [0004] Some of the technologies currently being developed for the transfer process include pick and place, laser lift-off (LLO), and self-assembly. Among these techn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L21/67
CPCH01L33/48H01L21/67253H01L2933/0033H01L25/0753H01L33/0095H01L24/95H01L24/75H01L24/80H01L24/81H01L24/83H01L2224/75101H01L2224/7565H01L2224/75655H01L2224/75701H01L2224/75705H01L2224/75725H01L2224/75735H01L2224/75804H01L2224/75822H01L2224/75824H01L2224/75901H01L2224/7598H01L2224/80006H01L2224/80013H01L2224/80121H01L2224/81005H01L2224/81022H01L2224/81121H01L2224/83005H01L2224/83022H01L2224/83121H01L2224/95085H01L2224/95101H01L2224/95144H01L2224/95145H01L2924/12041H01L25/50H01L21/6835H01L2221/68309H01L2221/6835H01L2221/68363H01L2924/3511H01L2924/00012H01L21/67709H01L21/67718H01L21/67757H01L21/67796H05K13/046H05K13/027H05K13/0478
Inventor 杨仁范郑相识郑任悳崔凤云
Owner LG ELECTRONICS INC
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