Middle frame of electronic product, manufacturing method of middle frame, shell of electronic product and electronic product
A technology of electronic products and production methods, which is applied in the direction of electrical equipment casings/cabinets/drawers, electrical components, casings/cabinets/drawer parts, etc., which can solve the problem of no ceramic white color effect, low color brightness, and unattainable Ceramic white and other issues, achieve the effect of gorgeous effect, high brightness, and improve the overall brightness
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preparation example Construction
[0052] The preparation process of the first UV adhesive layer 140 includes: the pre-baking temperature is 50°C-60°C, the pre-baking time is 3min-5min; the humidity of the spray booth is 45%-70%, and the temperature of the spray booth is 18°C-25°C; The irradiation energy of the furnace is 900mj / cm 2 ~1200mj / cm 2 . The above only lists a commonly used UV adhesive layer preparation process, but is not limited thereto, and can also be a commonly used UV adhesive layer preparation process in the art.
[0053] Further, the thickness of the first UV adhesive layer 140 is 8 μm˜12 μm. In one embodiment, the thickness of the first UV adhesive layer 140 is 8 μm, 9 μm, 10 μm, 11 μm or 12 μm.
[0054] The function of the second UV adhesive layer 150 is mainly to protect the optical film layer 130 and improve the overall wear resistance of the middle frame 100 of the electronic product. The composition and preparation process of the second UV adhesive layer 150 are the same as those of ...
Embodiment 1
[0091] The manufacturing process of the middle frame of the electronic product in this embodiment is specifically as follows:
[0092] (1) Spray coating on the substrate to form a coating layer with a thickness of 15 μm. Wherein, the raw material of the paint layer is composed of paint main agent and 783 slow-drying water (thinner) with a mass ratio of 1:3. In parts by mass, the paint main agent is composed of 20 parts of ABS resin, 30 parts of titanium dioxide (white pigment), 30 parts of 783 slow-drying water (solvent) and 2 parts of dispersant (auxiliary).
[0093] (2) Forming a first UV adhesive layer with a thickness of 10 μm on the side of the coating layer away from the substrate. The raw material of the first UV adhesive layer consists of photoinitiator, auxiliary agent and 783 slow drying water (diluent).
[0094] (3) Sputtering sequentially on the side of the first UV glue layer away from the substrate to form a first high refractive index layer, a first low refrac...
Embodiment 2
[0097] The manufacturing process of the middle frame of the electronic product in Example 2 is similar to the manufacturing process of the middle frame of the electronic product in Example 1, except that the material and thickness of the optical film layer are different. In the optical film layer of embodiment 2, the material of the first high refractive index layer is TiO 2 , the thickness is 21nm, the material of the first low refractive index layer is SiO 2 , with a thickness of 28nm. The material of the second high refractive index layer is TiO 2 , with a thickness of 39nm.
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