Rotary multi-target material magnetron sputtering cathode

Abstract

The invention relates to the technical field of magnetron sputtering, and provides a rotary multi-target material magnetron sputtering cathode. The rotary multi-target mateiral magnetron sputtering cathode comprises an anode and a magnet assembly, wherein a sputtering hole is formed in the anode, a target material support and target materials are arranged between the magnet assembly and the anode,a sputtering area is formed between the sputtering hole and the target material, the target materials are arranged on the target material support, the target materials match with the magnet assemblyin size, any target materials rotate to the sputtering area through the target material support, only the target materials rotating to the position over the magnet assembly can generate magnetron sputtering, and due to the fact that the magnetic field of the positions where other target materials are located is extremely weak, sputtering airflow is insufficient, glow sputtering cannot be generated. The problems that in the prior art, only one target material can be fixed through one sputtering cathode, and different materials cannot be sputtered at the same position are solved.

Description

technical field [0001] The invention relates to the technical field of magnetron sputtering, in particular to a rotary multi-target magnetron sputtering cathode. Background technique [0002] The working principle of magnetron sputtering is that a permanent magnet forms a magnetic field on the surface of the target, and the process gas (usually argon) for sputtering is passed into the target attachment. When the sputtering voltage is applied to the target, the An electric field is formed between the anode and the anode. Under the joint action of the electric field and the magnetic field, the argon gas is ionized to form a plasma, in which the argon ions are attracted by the sputtering voltage and accelerate to fly to the target. Atoms are bombarded, and the bombarded target atoms fly away from the target and land on the substrate to be coated to form a film. The conventional magnetron sputtering cathode target is installed on the oxygen-free copper substrate, the permanent ...

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Problems solved by technology

[0004] The invention proposes a rotary multi-target magnetron sputtering cathode. This structure not only solves the problems of large process chamber size and high equipment cost, but also realizes the sputtering of different materials at the same position.

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