Voltage stabilizing device for glue coating and developing equipment and glue coating and developing equipment

Abstract

The present invention provides a voltage stabilizing device for glue-coating and developing equipment and the glue-coating and developing equipment. The voltage stabilizing device for glue-coating and developing equipment includes a wind tunnel, which has an air inlet end and an air outlet that axially penetrate both ends of the wind tunnel. The through hole at the air end, the side wall of the through hole is provided with a limit opening; the bearing is axially arranged in the through hole; the piston cooperates with the limit opening to open or close the through hole; the spring, the spring One end close to the limit port is fixed on the bearing through a spring limit rod on the bearing; the crank and crank connecting rod are arranged on the side of the spring far away from the air inlet end, and the The crank is connected to the end of the spring far away from the limiting opening; the propeller is arranged on the end of the bearing close to the air outlet. The technical solution provided by the invention can stabilize the pressure difference between the glue application developing chamber and the outside atmosphere, thereby enabling the uniformity of the film thickness on the surface of the wafer to be controlled within the specification and reducing the rework rate of the wafer.

Description

The voltage stabilizer of the glue coating and developing equipment and the glue coating and developing equipment technical field The present invention relates to the field of semiconductor manufacturing, in particular to a voltage stabilizer of a glue-coating developing device and a glue-coating display device. shadow equipment. Background technique In the process of manufacturing semiconductor devices, the equipment used in the photolithography process includes a glue developing equipment (Track equipment). equipment) and exposure equipment. Among them, the glue coating and developing equipment contains many work areas with different functions, and each work area is a single work area. Separate chambers, the chambers in each working area communicate with each other and communicate with the exposure chambers in the exposure equipment. Referring to Fig. 1, Fig. 1 is the structural representation of existing glue developing equipment, as can be seen from Fig. 1, glue...

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Problems solved by technology

But when the external air pressure is affected by bad weather (such as typhoon), the external air pressure decreases rapidly, and the object stage chamber 10 and the interaction chamber 50 communicated with the outside world are first affected, because only dust-proof The circulating gas filter 80, a large amount of air leakage in the stage chamber 10 and the interaction chamber 50 cause the air pressure in the wafer transfer chamber 20 and the cleaning chamber 40 to also decrease rapidly, and finally pass to the glue-coating and developing chamber 30, and the coating The glue developing chamber 30 is deflated a lot, and the outward exhaust air flow W4 of the glue developing chamber 30 also drops rapidly simultaneously, resulting in the decrease of the exhaust air flow W1 entering the spin coating chamber 70, and the film with high flatness on the wafer surface Due to the fluctuation of the exhaust air flow W1, the jagged feature of the film surface is enlarged, that is, the range of the film thickness (range) becomes larger, that is, the uniformity of the film thickness is reduced, and it often exceeds the specification (Spec, within a certain range above and below the target value, this The range is determined by the specific process)

[0005] Therefore, it is necessary to propose a voltage stabilizing device for glue coating and developing equipment to solve the problem that the film thickness jump on the wafer surface exceeds the specification caused by the violent fluctuation of the external atmospheric pressure of the equipment

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