Multi-angle exposure equipment and manufacturing method of electroplated metal wire

A metal wire, electroplating metal technology, applied in microlithography exposure equipment, optomechanical equipment, removal of conductive materials by chemical/electrolytic methods, etc., can solve the problems of high technical strength, difficult to manufacture, etc.

Pending Publication Date: 2021-03-30
恒煦电子材料国际有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This kind of process uses the technology of double-layer photoresist. To expose and develop the doubl

Method used

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  • Multi-angle exposure equipment and manufacturing method of electroplated metal wire
  • Multi-angle exposure equipment and manufacturing method of electroplated metal wire
  • Multi-angle exposure equipment and manufacturing method of electroplated metal wire

Examples

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Embodiment Construction

[0034] According to an embodiment of the present invention, the present invention uses the prepared metal wire seed layer as a photomask, and simultaneously uses a scattering layer as an auxiliary layer for back exposure, so as to solve the problem of exposure when the metal wire seed layer is used as a photomask. Diffraction problems will occur, and the structure required for exposure to the negative photoresist can be accurately fabricated. The manufacturing process is simple, easy to implement, and low in cost, which greatly improves the yield of the high aspect ratio electroplating process.

[0035] Please refer to figure 1 , a flow chart of a method for manufacturing an electroplated metal wire disclosed in the present invention, please refer to Figures 2A-2K , Figures 3A-3J An embodiment of the production process, including:

[0036] Step S101 : forming a seed metal wire layer on a transparent substrate, and the wires of the seed metal wire layer have been fabricated...

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Abstract

The invention discloses multi-angle exposure equipment and a manufacturing method of an electroplated metal wire, and the manufacturing method comprises the steps: forming a sub-metal wire layer on atransparent substrate, so a wire of the sub-metal wire layer is manufactured; forming a photoresist layer above the seed metal wire layer; taking the seed metal wire layer as a photomask layer, and performing scattering type exposure on the photoresist layer through the seed metal wire layer by using multi-angle exposure equipment; removing the unexposed photoresist layer to expose the seed metalwire layer; electroplating the seed metal wire layer to a predetermined thickness to form a metal wire layer; and removing the remaining photoresist layer. The method is simple in process, easy to implement and low in cost, and the yield of the high aspect ratio electroplating process is greatly improved.

Description

technical field [0001] The present invention relates to an electroplating metal technology, in particular to a multi-angle exposure equipment and a method for making electroplated metal wires. Background technique [0002] With the rapid development of portable electronic devices, the miniaturization of components, the reduction of circuit board line width, the improvement of precision, and the reduction of power consumption have made high-aspect-ratio copper electroplating process become a popular science. [0003] At present, the copper electroplating process with high aspect ratio can achieve a line width of 1 micron to 15 micron and a thickness of 10 micron to 100 micron. However, in order to achieve such precision, it must be realized through exposure and development process. In order to make high-aspect-ratio copper wires, it is necessary to form an extremely thin seed copper metal layer on the substrate, and then go through processes such as forming a photoresist lay...

Claims

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Application Information

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IPC IPC(8): H05K3/20H05K3/06G03F7/20
CPCG03F7/7005G03F7/7015H05K3/062H05K3/205
Inventor 许铭案谢东宏陈香婷
Owner 恒煦电子材料国际有限公司
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