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Electronic control device

A technology for electronic control devices and electronic components, applied in electrical equipment shells/cabinets/drawers, printed circuits, printed circuits, etc., can solve the problems of reducing the stress to the sealing part, increasing the sealing length, expensive, etc., to prevent coating corrosion, The effect of improving corrosion resistance

Active Publication Date: 2021-03-30
HITACHI ASTEMO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, due to the environment (thermal deformation, height change, etc.), the deformation of the control device becomes large, but it is necessary to reduce the stress on the sealing part and increase the length of the seal
In addition, in the anti-corrosion countermeasures of steel plate materials, countermeasures using special anti-corrosion treatment can be adopted, but they are generally not distributed in the market, so they become expensive

Method used

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  • Electronic control device
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] figure 1 It is a perspective view of the electronic control device 1 according to the first embodiment of the present invention. In addition, in order to make the drawing easier to see, electronic components and the like mounted on the board are omitted.

[0032] Such as figure 1 As shown, the electronic control device 1 mainly includes a printed wiring board 10 , a case 20 , a cover 22 , and three connectors 32 .

[0033] Electronic components and the like are mounted on the printed wiring board 10 . The case 22 protects the printed wiring board 10 . In the housing 20, at least three wide openings 21 through which the connector 32 is inserted are provided on a plane.

[0034] The cover 22 is fixed to the housing 20 to seal the opening 20 b of the housing 20 . The connector 32 is electrically connected to the printed wiring board 10 . The sealing material 28 waterproofs between the opening edge 20 c of the case 20 and the inner surface of the peripheral edge 22 d ...

Embodiment 2

[0054] Figure 8 It is a main part front view of the cover 22 of the electronic control device 1 of Example 2 of this invention.

[0055] In order to forcibly generate the plating crack 24a, a circular groove portion 33c is provided around the contact portion 22a between the inner side of the cover and the case base.

[0056] Figure 9 It is a sectional view of main parts of the cover 22 of the electronic control device 1 according to the second embodiment of the present invention. Such as Figure 8 In this way, the processed portion 33 is provided near the contact portion 22c between the inner side of the cover and the case base, and a plating crack 24a for exposing the base material is generated. In order to generate the plating crack 24a, a circular groove 33c is provided near the contact portion 22a between the inner side of the cover and the case base, and a plating crack 33d is formed at the position of the circular groove. The base material is exposed due to the pla...

Embodiment 3

[0059] Figure 10 It is a main part front view of the cover 22 of the electronic control device 1 of Example 3 of this invention.

[0060] In order to forcibly generate the plating crack 24a, a triangular groove portion 33e is provided on the periphery of the contact portion 22a between the inner side of the cover and the case base.

[0061] Figure 11 It is a sectional view of main parts of the cover 22 of the electronic control device 1 according to the second embodiment of the present invention. Such as Figure 8 In this way, the processed portion 33 is provided near the contact portion 22c between the inner side of the cover and the case base, and a plating crack 24a for exposing the base material is generated. In order to generate the plating crack 24a, a triangular groove 33c is provided near the contact portion 22a between the inner side of the cover and the housing base, and a plating crack 33f is formed at the location of the triangular groove. The base material i...

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PUM

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Abstract

The present invention addresses the problem of providing an electronic control device having a structure that suppresses the corrosion of plating and completely seals a board side in a corrosive environment. This electronic control device 1 has: a printed wiring board 10 provided with electronic components; a case 20 for accommodating the printed wiring board 10; and a cover 22 provided to the case 20. A bonding surface is provided between the case 20 and the cover 22, is connected to respective surfaces thereof via a seal material 28, and causes said surfaces to face each. A screw 30 passingthrough the cover 22 or the case 20 is provided to the bonding surface. Plating 24 is provided to the outer surface of the case 20 or the cover 22 having a through-hole through which the screw 30 passes. A base material exposed part 25a formed due to the plating 24 being partially peeled off is provided on the inside of the case 20 or the cover 22, and is further inside the case 20 than the through hole. The seal material 28 intrudes into the exposed part 25a of the base material.

Description

technical field [0001] Electronic controls. Background technique [0002] Regarding the requirements for electronic control devices installed in the engine room, there are many requirements such as waterproof, heat resistance, corrosion resistance, EMC, and the like. In addition, the life of the product is also required to be extended, and it is also necessary to ensure the operation in such a use environment, which has become a situation that is difficult to satisfy at low cost. [0003] Furthermore, as the vehicle becomes more functional, the size of the control device is increased, and a low-cost and high-quality design is required. Due to the increase in size, the number of sealed parts also increases, and in order to make it cheaper, it is necessary to reduce the amount of the sealing material. In addition, the deformation of the control device increases due to the environment (thermal deformation, height change, etc.), but it is necessary to reduce the stress on the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/06F16B5/02F16J15/14H05K5/03
CPCF16B5/02H05K5/06C23C22/00C23C2/06F16B11/006H05K5/0052C25D5/12F16J15/14H05K2201/0999
Inventor 药泽健太执行俊和
Owner HITACHI ASTEMO LTD