Radio frequency conduction test method and related device

Abstract

The invention provides a radio frequency conduction test method and a related device. The method comprises the steps that a radio frequency test pin is moved to a first bonding pad of a single board,so that a test signal on the first bonding pad is transmitted to the radio frequency test pin and then transmitted to a radio frequency test instrument for a radio frequency conduction test, and the test signal in the radio frequency test pin is transmitted to the radio frequency test instrument through an impedance conversion device and a directional coupler; a straight-through output port of thedirectional coupler is connected with a first measurement port of the radio frequency test instrument, and a coupling output port of the directional coupler is connected with a second measurement port of the radio frequency test instrument; and after the radio frequency conduction test is finished, the radio frequency test needle is moved away, and the series device to be welded is repaired and welded on the first bonding pad and the second bonding pad of the single board, so that the radio frequency front-end circuit and the radio frequency rear-end circuit on the single board are smoothly connected. According to the method, more devices do not need to be added for testing, the layout area of the single board is saved, and the device cost is reduced.

Description

technical field [0001] The present application relates to radio frequency conduction test technology, in particular to a radio frequency conduction test method and related devices. Background technique [0002] As we all know, the process of producing wireless terminal products is not simple, and various tests need to be carried out on the wireless terminal products to ensure that the functions of these wireless terminal products are intact. For example, the process of producing mobile phones includes Surface Mount Technology (SMT), Single board functional test (Functional Test, FT), assembly, pre-processing (Assembly), machine test (Man-Machine Interface, MMI), etc. When processing a single board of a wireless terminal product, it is usually necessary to conduct a conduction test of radio frequency indicators on the single board. [0003] In the prior art, RF test needles and RF switch test sockets are usually used for RF conduction testing, but the RF switch test sockets ...

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Problems solved by technology

[0003] In the prior art, RF test pins and RF switch test sockets are usually used for RF conduction testing, but the RF switch test sockets generally have no other functions after the test is completed. The layout area of ​​the single board is increased, and the device cost of the product is increased

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