Wafer slicing machine

Abstract

The invention discloses a wafer slicing machine. The wafer slicing machine is structurally provided with a control table, a supporting seat, a placing table, a side rail and an operation body. An integral connecting block is driven by a sliding connecting wheel to integrally do arc-direction expansion and compression movement, a mutual force spring assists the integral connecting block to reset, so that the integral connecting block circularly does arc-shaped opening and closing, gas circulates through a ventilation opening, and the flow speed of the gas is changed, and therefore, the airflow in the interior of a lower embedding area is actively changed; in the flowing process of the gas passing through a flow dredging cavity, and rotating body rotates to further drive the gas to flow and change the flow speed of the gas, so that the gas discharges downwards more quickly, blowing gas is generated at the lower end, and heat gas is advantageously blown away; a circumferential groove serves as a cavity groove additionally formed in a cutting edge, and therefore heat can be effectively homogenized; and a rotating scattering block is transversely embedded into the circumferential grooves in a penetrating mode, circularly swing in a radian mode under the elastic effect of a spring, and drive surrounding airflow to flow in the swinging process through the overall cross-shaped structure of the rotating scattering block, so that the airflow flowing force is increased, and diffusion of heat gas is facilitated.

Description

technical field

[0001] The invention belongs to the field of wafer slicers used for chips, and more specifically relates to a wafer slicer. Background technique

[0002] As a semiconductor material, wafers are usually produced and used in the form of wafers. Wafer slicers are processing machines for wafer sheet processing. Slicer scribing includes diamond scribing and laser scribing. The knife slits the wafer to obtain a wafer that meets the required size.

[0003] Based on the inventor's discovery above, the existing wafer slicing machine has the following deficiencies:

[0004] When the diamond scribing knife of the slicer slices the wafer, due to the poor thermal conductivity of the wafer, the frictional heat generated by the friction between the scribing knife and the scribing knife is difficult to dissipate quickly during the scribing process, and the scribing knife always carries Frictional heat will cause edge chipping during the scribing process. The heat will easi...

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