Electroplating equipment with impurity removal function

A technology of electroplating equipment and functions, applied in the field of electroplating equipment with impurity removal function, can solve the problems of prolonging the time for the formation of the coating layer on the surface of the workpiece, reducing the reliability of electroplating equipment, reducing the quality of electroplating finished products, etc. High practicability and effect of preventing influence
CN112626599AInactive Publication Date: 2021-04-09南京鸿音工程技术有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
南京鸿音工程技术有限公司
Publication Date
2021-04-09
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to electroplating equipment with an impurity removal function. The electroplating equipment comprises a bottom plate, a main body, a top plate, a hook, two lifting devices, four support blocks, an impurity removal mechanism and two stirring mechanisms, wherein the impurity removal mechanism comprises an impurity removal box, a filter screen, a connecting pipe and two circulating assemblies, the stirring mechanism comprises a moving plate, a first limiting rod, a second limiting rod, a first spring and two transmission assemblies. According to the electroplating equipment with the impurity removal function, through the impurity removal mechanism, the function of removing impurities from a plating solution is achieved, the impurity content of the plating solution is reduced, the influence on the electroplating quality is avoided, and therefore the reliability of the equipment is improved; and through the stirring mechanism, the function of stirring the plating solution in the main body is realized, and the flowing speed of the plating solution is increased, so that the speed of covering a workpiece with the plating solution can be increased, the electroplating working efficiency is improved, the reliability of equipment is improved, cations in the plating solution are uniformly distributed, and the electroplating quality is improved.
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Description

technical field

[0001] The invention relates to the field of hardware equipment processing, in particular to an electroplating equipment with the function of removing impurities. Background technique

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation ( Such as rust), improve wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhance the appearance, etc. The outer layer of many coins is also electroplated.

[0003] When the existing electroplating equipment is working, more impurities and residues will be produced in the plating solution. When the plating solution contains too many impurities, it will affect the electroplating work and reduce the quality of the electroplating finished p...

Claims

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