Optical fiber bundle fusion packaging device and packaging method

The technology of a packaging device and packaging method, which is applied in the direction of bundled optical fibers, can solve the problems of affecting the effect of induction heating, complicated optical fiber metallization process, and high cost of optical fiber metallization, so as to achieve fast molding, eliminate the risk of optical fiber damage, and reduce The effect of production costs

Pending Publication Date: 2021-04-13
JIANGSU FASTEN OPTOELECTRONICS TECH
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Problems solved by technology

This method uses the metal coating as the medium to heat-cure the optical fiber bundle into a whole, which overcomes the shortcomings of the adhesive package, but the metallization process of the optical fiber is complicated, and the uniformity of the coating thickness will affect the effect of induction heating, and the metallization cost of the optical fiber is also relatively high. high

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  • Optical fiber bundle fusion packaging device and packaging method
  • Optical fiber bundle fusion packaging device and packaging method

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Embodiment Construction

[0023] The present invention will be further described in detail below with reference to the embodiments of the accompanying drawings.

[0024] like figure 1 , 2 As shown, an optical fiber bundle fusion packaging device in this embodiment includes a cylindrical lateral pressing mold 4, and the lateral pressing mold 4 is set in the inner cavity of the high-frequency induction heating equipment, so that the high-frequency induction heating equipment The induction coil 3 surrounds the lateral press mold 4. A through fiber passage 4.1 is set in the center of the lateral press mold 4, and the diameter of the entrance end of the fiber passage 4.1 is larger than the diameter of the outlet end of the fiber passage 4.1, so that the longitudinal section of the fiber passage 4.1 is an inverted trapezoid. The bare fiber section of the fiber bundle 1 is arranged in the fiber passage 4.1, and the diameter of the exit end of the fiber passage 4.1 corresponds to the diameter of the fiber bu...

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Abstract

The invention relates to an optical fiber bundle fusion packaging device and packaging method, and belongs to the technical field of optical fiber packaging. The device comprises a lateral pressurizing mold, and the lateral pressurizing mold is arranged in an inner cavity of high-frequency induction heating equipment, so that an induction coil of the high-frequency induction heating equipment surrounds the lateral pressurizing mold. An optical fiber bundle is movably arranged in the lateral pressurizing mold in a penetrating mode and can vertically move along the lateral pressurizing mold. The high-frequency induction heating equipment heats the lateral pressurizing mold, so that the bare fiber section of the optical fiber bundle in the lateral pressurizing mold is softened, then circumferential pressure is applied to the softened bare fiber section of the optical fiber bundle through the lateral pressurizing mold, and fusion packaging of the optical fiber bundle is realized. According to the invention, the operation is convenient, the optical fiber bundle packaging time is shortened, the optical fiber bundle packaging efficiency is improved, and the production cost is reduced. After hot melting, the optical fiber bundle is a homogeneous whole, there is no heterostructure in the optical fiber bundle, and the risk of optical fiber damage caused by thermal stress is avoided.

Description

technical field [0001] The invention relates to an optical fiber bundle fusion packaging device and a packaging method thereof, belonging to the technical field of optical fiber packaging. Background technique [0002] With the continuous development of information technology, the application of optical fiber has become more and more extensive. Optical devices made of optical fibers play an important role in the fields of optical fiber sensing, optical signal processing, medical devices and lighting systems. Among them, optical devices made on the basis of optical fiber bundles can play the role of transmitting multiple different optical signals simultaneously or in time division in various application fields. [0003] At present, the encapsulation method of silica fiber bundles is bonded by adhesives, and the viscosity and particle size of the adhesives affect the tightness of the arrangement of the fiber bundles. During the curing process, the difference in the coefficie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/04
CPCG02B6/04
Inventor 周巧林张恩隆孙伟雄马慧影葛几凡缪礼晔张冬梅曹兵张尧宇
Owner JIANGSU FASTEN OPTOELECTRONICS TECH
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