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A pcb buffer design method and pcb board for preventing bga tin cracking

A technology of PCB board and design method, applied in the direction of printed circuit, printed circuit parts, printed circuit stress/deformation reduction, etc., can solve the problems of many tin cracks in BGA chips, influence of BGA chip quality, and low repairability. To achieve the effect of reliable design principle, prominent substantive features and simple structure

Active Publication Date: 2022-05-27
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Aiming at the above-mentioned card stress in the prior art and the non-buffering of the PCB, there are many problems of BGA chip tin cracking, and the repairability is relatively low, which has a great impact on the quality of the BGA chip. The present invention provides a method to prevent BGA tin Cracked PCB buffer design method and PCB board to solve the above technical problems

Method used

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  • A pcb buffer design method and pcb board for preventing bga tin cracking
  • A pcb buffer design method and pcb board for preventing bga tin cracking
  • A pcb buffer design method and pcb board for preventing bga tin cracking

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Embodiment 1

[0060] like figure 1 As shown, the present invention provides a PCB buffer design method for preventing BGA tin cracks, comprising the following steps:

[0061] S1. Obtain the number of layers of the PCB, and set the adjacent layers of the upper surface layer and the adjacent layers of the lower layer of the PCB as elastic GND reflow layers;

[0062] S2. Obtain the position of the BGA pad corresponding to the pin of the BGA chip on the surface of the PCB, set a concave groove inside the BGA pad, and set a shrapnel in the concave groove.

Embodiment 2

[0064] like figure 2 As shown, the present invention provides a PCB buffer design method for preventing BGA tin cracks, which is characterized in that it includes the following steps:

[0065] S1. Obtain the number of layers of the PCB, and set the adjacent layer of the upper surface layer and the adjacent layer of the lower layer of the PCB as the elastic GND reflow layer; the specific steps are as follows:

[0066] S11. Obtain the number of layers of the PCB, and set the number of layers of the PCB to be greater than or equal to four layers;

[0067] S12. Set the adjacent wire layer on the top layer of the PCB as the upper surface layer of the PCB as the upper elastic GND reflow layer, and set the withstand temperature of the upper elastic GND reflow layer to be greater than the temperature threshold;

[0068] S13. Set the adjacent wire layer of the bottom layer of the PCB as the bottom layer of the PCB as the lower elastic GND reflow layer, and set the withstand temperatu...

Embodiment 3

[0087] like Figure 4 As shown, the present invention provides a PCB board for preventing BGA tin cracks, comprising a PCB buffer device 1 and a concave groove pad 2;

[0088] The PCB buffer device 1 is arranged on the GND reflow layer adjacent to the upper surface layer and the lower layer of the PCB to form an elastic GND reflow layer;

[0089] The concave groove pad 2 is arranged at the position of the original BGA pad corresponding to the pin of the BGA chip on the surface of the PCB;

[0090] The concave groove pad includes a groove wall 2.1 and a pad surface 2.2, and the groove wall 2.1 is connected with the pad surface 2.2 to form a cavity 2.3, and an elastic sheet 2.4 is arranged in the cavity 2.3.

[0091] In some embodiments, the PCB buffer device 1 uses a conductive elastic material, and the conductive elastic material can withstand a temperature greater than a temperature threshold; the temperature threshold can be set to 200 degrees.

[0092] In some embodiments...

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Abstract

The present invention provides a PCB buffer design method and a PCB board to prevent BGA tin cracking, said method: S1. Obtain the number of layers of the PCB, and set the adjacent layers of the upper surface layer and the adjacent layer of the lower surface layer of the PCB as elastic GND Reflow layer; S2. Obtain the BGA pad position corresponding to the BGA chip pins on the surface of the PCB, set a concave groove inside the BGA pad, and set shrapnel in the concave groove; the PCB board includes a PCB buffer device and a concave groove Welding pad; the PCB buffer device is arranged on the GND reflow layer adjacent to the upper surface layer and the lower surface layer of the PCB to form an elastic GND reflow layer; the concave groove pad is arranged on the original BGA pad position corresponding to the BGA chip pin on the surface layer of the PCB The concave groove pad includes a groove wall and a pad surface, and the groove wall is connected to the pad surface to form a cavity, and a shrapnel is arranged in the cavity. The invention avoids tin cracks in the BGA after the PCB is stressed and in the process of handling.

Description

technical field [0001] The invention belongs to the technical field of PCB design, and in particular relates to a PCB buffer design method and a PCB board for preventing BGA tin cracks. Background technique [0002] PCB, is the abbreviation of Printed Circuit Board, printed circuit board. [0003] PP, short for Prepreg, is a thin sheet insulating material of PCB, which is mainly used as a composite material and insulating material for the inner conductive pattern of multi-layer PCB plate making. [0004] SMT is the abbreviation of Surface Mounted Technology, surface mount technology, a welding process for label parts. [0005] With the continuous development of cloud data, AI, big data and other applications, the computing performance requirements of network servers are getting higher and higher, and the powerful functions come from the improvement of motherboard computing and storage. Therefore, the versatility of electronic products has developed, and the integration of B...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K1/02
CPCH05K3/00H05K1/0271
Inventor 吕瑞倩吕振山
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
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