PCB with screw through hole stress buffering and aligning device and processing method

Abstract

The invention provides a PCB with a screw through hole stress buffering and aligning device and a processing method, the PCB comprises an even number of layers of PCB main bodies, the PCB main bodies are provided with screw through holes, the screw through holes are in threaded connection with screws, a circle of tin bar is arranged around each screw through hole, the lower side of the tin bar is provided with a vibration buffering device. The number of layers of the PCB main body is 8-34, preferably, the number of layers of the PCB main body is 8, the 8 layers are respectively marked as L1-L8 layers from top to bottom, and the L2 layer and the L7 layer are signal backflow layer surfaces. When the vibration buffering device of the PCB main body is subjected to an external acting force, the PCB main body generates an opposite elastic force at the downward concave moment under the action of the buffering elastic sheet, and the opposite elastic force counteracts the external acting force, so that the tin bar is bounced back to an original position, and the situation that the tin bar is directly broken or cracked after being stressed is avoided.

Description

technical field [0001] The invention relates to the field of PCB boards, in particular to a PCB board with a screw through hole stress buffering and alignment device and a processing method. Background technique [0002] With the continuous development of cloud data, AI, big data and other applications, the computing performance requirements of network servers are getting higher and higher. The powerful computing performance of network servers comes from the support of electronic components such as motherboards and chips. The number of precision parts and BGA chips continues to increase, and while the BGA chips and high-density electronic components are installed more and more densely on the motherboard, it also seriously affects the spatial layout of the screw holes in the PCB board. On the other hand, due to the server motherboard Functions are becoming more and more abundant, so it is necessary to add a variety of add-in cards and external devices to be installed on the m...

AI Technical Summary

Problems solved by technology

[0005]In order to overcome the above-mentioned prior art, when installing screws, it is easy to cause offset and scratch the circuit on the PCB board, which will cause short circuit or failure, and when installing screws Stress will cause the problem of tin cracking of BGA and parts. The present invention provides a PCB board with a screw through hole stress buffer and an alignment device and a processing method. By designing a high temperature resistant and conductive buffer next to the screw through hole of the PCB layer device to avoid tin cracking of parts caused by locking stress

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