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PCB processing technology

A technology of processing technology and process, applied in the field of PCB processing technology, can solve the problem of low hole depth accuracy, achieve the effect of ensuring quality and improving process manufacturing capacity

Inactive Publication Date: 2021-04-13
DYNAMIC ELECTRONICS KUNSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem mainly solved by the present invention is to provide a PCB processing technology. In the through-hole processing, the problem of too small spacing of the via holes is solved by the method of partial resin plug holes, so as to ensure the quality of the resin plug holes and improve the manufacturing capacity of the process; In blind hole processing, the problem of low hole depth accuracy in mechanical processing is solved by combining mechanical processing and laser laser

Method used

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Embodiment

[0034] A PCB processing technology, such as figure 1 As shown, the processing flow includes:

[0035] 1. Cutting and baking the board (to release the internal stress of the substrate);

[0036] 2. Inner layer circuit (etching the inner layer circuit),

[0037] After the inner layer circuit is made, scan the board surface with an optical inspection machine to prevent gaps on the PAD at the bottom of the circuit / blind hole.

[0038] 3. Mechanical drilling:

[0039] In the way of mechanical drilling, drill through holes (including blind hole 1 and through hole 2) connecting each layer, wherein the machined hole depth of the blind hole is 1.5-2.5mil from the design depth. ;

[0040] In this embodiment, the aperture design is 0.35mm, and the machined hole depth is 0.25mm. After drilling, use the drilling film to check whether there is any missing drilling;

[0041] In addition, in this embodiment, in the mechanical drilling process, the angle of the drill is 160°, theoreticall...

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Abstract

The invention discloses a PCB processing technology, which comprises blind hole processing and through hole processing, wherein the blind hole processing procedure comprises mechanical drilling and laser processing; in the laser processing step, blind holes are processed according to the design size in a laser mode after the mechanical drilling step; and holes machined in through holes are via holes, and machining of the via holes comprises a drilling procedure, a rubberizing procedure, a resin hole plugging procedure and a degumming procedure which are sequentially conducted. According to the PCB processing technology, during through hole machining, the problem that the distance between via holes is too small is solved through a local resin hole plugging method, the quality of resin hole plugging is guaranteed, and the technology manufacturing capacity is improved; and in blind hole machining, the problem that the hole depth precision is not high in the machining process is solved in a machining and laser combined mode.

Description

technical field [0001] The invention belongs to the technical field of circuit board manufacturing, and in particular relates to a PCB processing technology. Background technique [0002] In circuit board manufacturing, blind holes, through holes and buried holes are important components of multilayer circuit board connectivity. With the development and progress of printed circuit board design, the miniaturization of electronic components is developing day by day. The design of via hole spacing is getting smaller and smaller≦0.25mm, and the requirements for the production of via holes are also getting higher. The rational use of space in circuit board design is more important. The traditional resin plugging process is limited by the jig. The distance between the hole and the non-plug hole requires a minimum design of 0.4mm. When the distance is less than 0.4mm, using the traditional method will cause the resin to enter the part hole, affect the size of the via hole, cause qu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0047H05K3/0026H05K3/0094
Inventor 黄铭宏
Owner DYNAMIC ELECTRONICS KUNSHAN