Dry ice cleaning equipment for semiconductor element

Abstract

The invention discloses dry ice cleaning equipment for a semiconductor element. The dry ice cleaning equipment comprises an equipment frame body, a dry ice generating mechanism, a dry ice spraying mechanism, a dry ice purifying mechanism and a cleaning chamber, wherein the dry ice generating mechanism, the dry ice spraying mechanism, the dry ice purifying mechanism and the cleaning chamber are mounted on the equipment frame body; the dry ice generating mechanism comprises a liquid carbon dioxide storage tank and a dry ice generator; the dry ice spraying mechanism comprises a dry ice nozzle boss for mounting a dry ice spray nozzle, and a manipulator for driving the dry ice nozzle boss to move; the dry ice purifying mechanism comprises an air intake fan and an air exhaust fan, the air intake fan communicates with the cleaning chamber, and the air exhaust fan communicates with the cleaning chamber; and the cleaning chamber is divided into an upper-layer cleaning part and a lower-layer material collecting part by a screen plate, a containing plate where a product can be placed is fixed on the screen plate, the cleaning chamber is provided with an air outlet, and the air outlet communicates with the air exhaust fan. According to the dry ice cleaning equipment, impurities such as burrs and particles on the surface of the semiconductor element are crushed by the dry ice particles, so that the surface of the semiconductor meets the requirement of high cleanliness.

Description

technical field [0001] The invention belongs to the technical field of semiconductor cleaning, in particular to a dry ice cleaning device for semiconductor elements. Background technique [0002] Due to the rapid development of science and technology, semiconductor chips have been developed towards miniaturization, and most of the chips are electronic components with different functions. These electronic components are usually welded on the substrate with electronic circuits by using solder, so that the electronic components Normal operation, however, due to the miniaturization of electronic components, the impurities generated during the chip production process will seriously affect the quality of the chip. During the semiconductor chip manufacturing process, if it is polluted by dust particles and metals, it is easy to cause the circuit function in the chip to be damaged. Damage, short circuit or open circuit, etc., lead to the failure of integrated circuits and affect the...

AI Technical Summary

Problems solved by technology

[0002] Due to the rapid development of science and technology, semiconductor chips have been developed towards miniaturization, and most of the chips are electronic components with different functions. These electronic components are usually welded on the substrate with electronic circuits by using solder, so that the electronic components Normal operation, however, due to the miniaturization of electronic components, the impurities generated during the chip production process will seriously affect the quality of the chip. During the semiconductor chip manufacturing process, if it is polluted by dust particles and metals, it is easy to cause the circuit function in the chip to be damaged. Damage, short circuit or open circuit, etc., lead to the failure of integrated circuits and affect the formation of geometric features. Therefore, the cleanliness of the surface of semiconductor chips is increasingly required in the production process. However, the use of traditional chemical cleaning methods will Consumes a lot of water and chemical reagents, causing unnecessary waste of resources

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