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High-heat-resistance water-soluble isocyanate modified epoxy resin for copper-clad plate, composition and preparation method of composition

An isocyanate and epoxy resin technology, which is applied in the manufacture of matrix resin for copper clad laminates, high heat-resistant water-soluble isocyanate-modified epoxy resin, compositions and the fields of preparation thereof, achieves good environmental performance, good toughness, and heat resistance. high effect

Active Publication Date: 2021-04-16
江苏东材新材料有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, there is no application of water-soluble isocyanate-modified epoxy resin with good comprehensive performance on copper clad laminates. With the gradual improvement of environmental protection and production safety requirements, water-soluble isocyanate-modified epoxy resin system is used It is particularly important to press the copper clad laminate

Method used

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  • High-heat-resistance water-soluble isocyanate modified epoxy resin for copper-clad plate, composition and preparation method of composition
  • High-heat-resistance water-soluble isocyanate modified epoxy resin for copper-clad plate, composition and preparation method of composition
  • High-heat-resistance water-soluble isocyanate modified epoxy resin for copper-clad plate, composition and preparation method of composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 3

[0045] A kind of high heat-resistant soluble isocyanate-modified epoxy resin for copper-clad laminates, the high-heat-resistant soluble isocyanate-modified epoxy resin for copper-clad laminates has a simplified chemical structure shown in (I):

[0046]

[0047] The copper-clad laminate is made of high heat-resistant isocyanate-modified epoxy resin by 4,4'-diaminodiphenylmethane tetraglycidyl epoxy resin and 4,4'-diisocyanate diphenylmethane (MDI for short) at high temperature (140~180°C) react with 2-ethyl-4-methylimidazole to generate isocyanate modified epoxy resin, then react with diethanolamine, add lactic acid, and finally add an appropriate amount of water and stir evenly to make a solid mass A high heat-resistant isocyanate-modified epoxy resin is used for copper-clad laminates with a mass percentage of 75%.

Embodiment 4

[0049] A high heat-resistant soluble isocyanate-modified epoxy resin for copper-clad laminates, the solid content of the high-heat-resistant soluble isocyanate-modified epoxy resin for copper-clad laminates is 75% by mass, and the viscosity is in the range of 1000 to 3000 mpas Inside, it is light yellow liquid; Others are the same as Example 3, omitted.

Embodiment 5

[0051] A preparation method of high heat-resistant isocyanate-modified epoxy resin for copper-clad laminates. 80 parts by mass of 4,4'-diaminodiphenylmethane tetraglycidyl epoxy resin is added to the reactor, and the temperature is raised to 140 ℃, add 0.02 parts by mass of 2-ethyl-4-methylimidazole, (slowly) dropwise add 10 parts by mass of 4,4'-diisocyanate diphenylmethane (MDI for short) liquid, stir, and heat up to 140 °C to react 4 hour, then lower the temperature to 80°C, add 5 parts by mass of diethanolamine, stir and react for 4 hours, then cool down to 60°C, add 4 parts by mass of lactic acid, and finally add an appropriate amount of water, stir evenly, and obtain the mass percent of solids High heat-resistant, heat-resistant, isocyanate-modified epoxy resin for copper-clad laminates with a content of 75%.

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Abstract

The invention discloses high-heat-resistance water-soluble isocyanate modified epoxy resin for a copper-clad plate, a composition and a preparation method of the high-heat-resistance water-soluble isocyanate modified epoxy resin. The method comprises the following steps: adding 4,4'-diaminodiphenylmethane tetraglycidyl epoxy resin, 2-ethyl-4-methylimidazole and 4,4'-diisocyanate diphenylmethane into a reactor, and carrying out stirring heating reaction; and then adding diethanol amine for reacting; and finally, adding a proper amount of water, and uniformly stirring the mixture to prepare the high-heat-resistance water-soluble isocyanate modified epoxy resin for the copper-clad plate, which has the solid content of 75%; uniformly mixing and stirring the isocyanate modified epoxy resin with an amino resin curing agent, a water-based isocyanate curing agent, boron trifluoride monoethylamine and water to prepare the high-heat-resistance water-soluble isocyanate modified epoxy resin composition for the copper-clad plate. The high-heat-resistance water-soluble isocyanate modified epoxy resin for the copper-clad plate and the composition are particularly suitable for being used as matrix resin for manufacturing the copper-clad plate, and are good in comprehensive performance, environmentally friendly and high in practicability.

Description

technical field [0001] The invention belongs to the synthesis modification and application of organic compound epoxy resin, and relates to a high heat-resistant isocyanate-modified epoxy resin for copper-clad laminates, a composition and a preparation method thereof. The (prepared) high heat-resistant and soluble isocyanate-modified epoxy resin and its composition product of the present invention are especially suitable as matrix resin for manufacturing copper-clad laminates. Background technique [0002] Copper clad laminate is the basic material of the electronics industry. It is mainly used to process and manufacture printed circuit boards (referred to as PCBs), and is widely used in various electronic products such as televisions, computers, and mobile communications. The existing resins for copper clad laminates basically use resins such as various common epoxy resins, brominated epoxy resins, halogen-free flame-retardant epoxy resins, heat-resistant epoxy resins, 4,4'-...

Claims

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Application Information

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IPC IPC(8): C08G59/30C08G59/26C08G59/56C08G59/40C07D413/14C07C59/08C07C51/41
Inventor 叶伦学唐文东黄杰
Owner 江苏东材新材料有限责任公司