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High-filling heat-conducting PA6/PP composite material with good glue adhesion and application thereof

A composite material and adhesion technology, applied in heat exchange materials, chemical instruments and methods, etc., can solve the problems of poor low temperature toughness of thermally conductive materials, reduced material toughness, and lack of glue.

Active Publication Date: 2021-04-27
BENSONG ENG PLASTICS HANGZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1) Due to the requirement of heat conduction, the proportion of thermally conductive filler and reinforcing filler in thermally conductive PA6 material is relatively high, usually above 50%, which will lead to poor fluidity of the material;
[0005] 2) PA6 heat conduction material has poor low-temperature toughness in winter, which is mainly manifested as assembly cracking. In the case of high filling, the material toughness is further reduced, and casting problems will occur during hot runner processing;
[0006] 3) When the PA6 thermal conductive material adopts the thin-walled multi-cavity processing mode, there will be processing defects such as difficulty in filling, lack of glue, etc.
For example, consider adding a polar lubricant to solve the problem, such as choosing the commonly used lubricant EBS with strong polarity; although the coupling agent has a certain polarity, it can also improve the surface polarity of the material to a certain extent, but it will be more It greatly affects the fluidity of the material, and the coupling agent is usually a liquid raw material, the production cost is high, and the production equipment is difficult to clean

Method used

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  • High-filling heat-conducting PA6/PP composite material with good glue adhesion and application thereof
  • High-filling heat-conducting PA6/PP composite material with good glue adhesion and application thereof
  • High-filling heat-conducting PA6/PP composite material with good glue adhesion and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0084] From the test data of Example 1 and Example 3, it can be seen that in the PA6 / PP system, the level of adhesion decreases with the increase of PP content. The reason is that the polarity of PP itself is very low, and as the amount of addition increases, the overall polarity of the alloy material will be reduced, thereby reducing the adhesion of the alloy material.

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Abstract

The invention discloses a high-filling heat-conducting PA6 / PP (Polyamide 6 / Polypropylene) composite material with good glue adhesion, which comprises the following components in parts by weight: 20-40 parts of PA6, 1-15 parts of PP, 35-50 parts of heat-conducting filler, 5-25 parts of reinforcing filler, 1-5 parts of a compatilizer, 1-5 parts of a flexibilizer, 0.1-5 parts of other assistants and 0.1-1 part of a polyol stearate lubricant. According to the invention, through the alloy of PA6 and PP, the problems of poor material fluidity, poor low-temperature toughness and thin-wall multi-hole processing defects caused by high filling of PA6 are solved. According to the invention, the lubricant performance of the polyol stearate lubricant in the resin processing process can be fully utilized, and when a product is bonded with glue, the adhesive force with the glue can be enhanced, the torque of the blister can be improved, and the performance requirements of the product can be met.

Description

technical field [0001] The invention belongs to the field of polymer compound compositions, and in particular relates to a highly filled and thermally conductive polymer compound composite material. Background technique [0002] Thermally conductive materials are often used in heat dissipation devices in the LED lighting industry. With the development of the industry, the requirements for material cost reduction, heat conduction and flame retardancy are getting higher and higher. The high filling of fillers can improve the thermal conductivity and flame retardancy of materials, therefore, more and more formulations of thermal conductive materials have been extensively studied. Usually, the proportion of thermally conductive materials and reinforcing fillers is more than 40% to meet the demand, but the fluidity and toughness of highly filled materials are very poor, and thin-walled products are difficult to process and brittle, especially in white thermally conductive materia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/02C08L23/14C08L51/06C08K13/04C08K7/14C08K3/22C08K5/20C08K5/103C09K5/14
CPCC08L77/02C09K5/14C08K2003/2224C08L2205/035C08L2205/025C08L23/14C08L51/06C08K13/04C08K7/14C08K3/22C08K5/20C08K5/103
Inventor 王一博巩玉钊张光辉张振北周永松
Owner BENSONG ENG PLASTICS HANGZHOU
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