A fully automatic grinding equipment for industrial smart chips

Abstract

The invention discloses a fully automatic grinding equipment for industrial intelligent chips, which comprises a worktable and a loading and unloading mechanism, a transfer table, a material transfer mechanism, a grinding mechanism, and a grinding bracket arranged on the worktable. The transfer table passes through Four outriggers are arranged laterally in the middle of the workbench, the material shifting mechanism is arranged on the left and right sides of the transfer table, the loading and unloading mechanism is arranged on the right side of the workbench, and is connected with the transfer table. The right side of the table is adjacent, the grinding bracket is arranged on the rear side of the transfer table, the grinding mechanism is vertically arranged on the grinding mechanism, and the loading and unloading mechanism is used to transfer the smart chip to be polished to On the transfer table, the polished smart chips are then unloaded; the invention has uniform grinding force, high grinding precision, effectively reduces the occurrence of defective grinding products, has high processing efficiency, saves manpower, improves benefits, and has good advantages Market application value.

Description

technical field [0001] The invention relates to the technical field of chip processing equipment, in particular to a fully automatic grinding equipment for industrial intelligent chips. Background technique [0002] During the production and processing of smart chips, the smart chips need to be drilled first, and then the inner diameter of the car is processed by the lathe. When the processing is completed, the size is measured. When the measurement is qualified, it flows into the next grinding process. Usually, the grinding of the smart chip is carried out. The work is to manually pass through the angle grinder, and then grind each smart chip one by one. However, due to the uneven grinding force, it is easy to cause uneven grinding of the inner diameter of the smart chip. For some smart chips that require high processing accuracy, It is very easy to produce defective products due to grinding. In addition, manual grinding requires continuous loading and unloading, resulting ...

AI Technical Summary

Problems solved by technology

Nowadays, with the advancement of integration technology, the improvement of equipment and the use of deep submicron technology, LSI, VLSI, and ULSI have appeared one after another. With the continuous increase, the power consumption has also increased. In order to meet the needs of development, on the basis of the original packaging varieties, a new variety has been added - ball grid array packaging. Due to the particularity of BGA packaging, the soldering of BGA chips The process requirements are very high. In the process of production and debugging, it is inevitable that the BGA chip will be replaced due to BGA damage or other reasons. At this time, disassembling the BGA can be regarded as the reverse process of soldering the BGA. However, today's electronic equipment requires more and more circuit boards. The smaller the size, the components on the circuit board tend to be small and dense, the number of layers on the circuit board is increasing, and there are a large number of electronic components around the chip. Once the chip is damaged, it is impossible to use the method of heating Replacement, high temperature will deform the multilayer board, damage the circuit and reduce the electrical performance, and cause other components to be damaged or displaced due to excessive temperature; at the same time, other tools cannot be used to assist in removal, because there will be gaps between the circuit board and the BGA. Using glue for bonding, too much force will damage the pads, and it is difficult to process them with sol, which makes the maintenance of BGA circuit boards a great difficulty. Now, three-axis engraving machines are commonly used to repair circuit boards. To polish the damaged BGA chip, this can ensure that the circuit board is not damaged, and at the same time does not require a clean room, and saves a lot of cost without heating. However, the existing grinding machine cannot automatically replace the worn tool, and the grinding time is long, increasing the cost. Craft Difficulty

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