Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

On-chip sensor reading system for complex SoC reliability monitoring

A readout system and sensor technology, applied in the field of system-on-chip, can solve the problems of inability to flexibly integrate various types of sensors, no priority in data processing, poor flexibility of sensor readout circuits, etc.

Active Publication Date: 2021-04-30
UNIV OF ELECTRONICS SCI & TECH OF CHINA
View PDF9 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] c. There are many types of sensors for reliability monitoring in complex SoCs, and most on-chip sensor readout circuits have poor flexibility, cannot flexibly integrate multiple types of sensors, and have no priority in data processing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • On-chip sensor reading system for complex SoC reliability monitoring
  • On-chip sensor reading system for complex SoC reliability monitoring
  • On-chip sensor reading system for complex SoC reliability monitoring

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] An on-chip sensor readout system 100 for complex SoC reliability monitoring, including a conventional sensor group 101, an emergency sensor group 102, a sensor network interface 103, a single-input port router 104, a dual-input port router 105, a three-input port router 106, Voltage / temperature sensor XADC107, universal asynchronous transceiver transmitter UART108, XADC network interface 109, UART network interface 110, token distribution unit 111. The conventional sensor group 101 includes a plurality of conventional sensors, and the conventional sensors are mainly responsible for collecting information that changes slowly such as aging and does not require emergency response. The emergency sensor group 102 includes a plurality of emergency sensors, and the emergency sensors are mainly responsible for collecting information that has a large impact and needs to be dealt with urgently, such as memory failure information. The conventional sensor group and the emergency se...

Embodiment 2

[0048] An on-chip sensor readout system for reliability monitoring of complex SoCs such as figure 1 As shown, the on-chip sensor readout circuit adopts a tree topology with a depth of 4, and the depth of the network can be flexibly adjusted according to the actual number of sensor groups. In the tree topology, the sensor group is placed at the leaf node, the root node can receive the sensor data transmitted in the on-chip network and send the sensor data to the host computer through the UART module through the dedicated interface, and the intermediate node is only responsible for data transmission.

[0049] The token distribution unit 111 sends tokens to the XADC interface 109 and each sensor interface 103 in a manner of token ring excitation sampling, and the token is a sampling enable signal. Token ring excitation sampling is to circulate to each interface at a certain time interval according to the order of XADC network interface, sensor network interface 1, XADC network i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an on-chip sensor reading system for complex SoC reliability monitoring. The on-chip sensor reading system comprises a sensor group, a sensor network interface, a router group, a voltage / temperature sensor, a universal asynchronous transceiving transmitter, a voltage / temperature sensor network interface, a universal asynchronous transceiving transmitter network interface and a token distribution unit. According to the system, the network-on-chip of a hierarchical tree topology structure is adopted, compared with network-on-chip of other topology forms, the area and power consumption expenditure are small, the routing algorithm is simple, the expandability of the network is good, meanwhile, reliability monitoring sensors with conventional data types and emergency data types can be flexibly borne, different types of sensor data processing has priorities, emergency data is firstly processed, and a token ring excitation sampling method is adopted to ensure the accuracy of temperature and voltage information during data sampling of each sensor.

Description

technical field [0001] The invention relates to the field of on-chip systems, in particular to an on-chip sensor readout system for complex SoC reliability monitoring. Background technique [0002] With the improvement of chip integration, the system-on-chip (SoC) design has evolved from a simple single-core design to a complex multi-core design. seriously affected. In this case, it is very important to actively study the reliability of digital integrated circuits, especially complex SoCs, and this basis is the real-time monitoring of various parameters in the circuit, which requires a low-power and low-power system for complex SoC reliability monitoring. area overhead for on-chip sensor readout circuitry. [0003] The main problems and pitfalls of current on-chip sensor readout circuits: [0004] a, As the number of sensors increases, the method of using an on-chip bus to connect the sensor array makes the interconnection of the bus not scalable and thus unable to handle...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01D21/02H04L9/32H04L12/753H04L12/865H04L47/6275
CPCG01D21/02H04L9/3213H04L45/48H04L47/6275Y02D30/50
Inventor 黄乐天王梓任谢暄赵天津
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com