Electrostatic adsorption disc for preventing circulating liquid from leaking

Abstract

The invention relates to the field of wafer process devices, and discloses an electrostatic adsorption disc for preventing circulating liquid from leaking, namely an embedded plate-shaped valve body, a valve plate and a valve plate propulsion controller are embedded in a circulating liquid through hole in the bottom surface. The valve plate propulsion controller drives the valve plate to extend into the circulating liquid through hole and cut off the circulating liquid through hole, so that the circulating liquid remaining in an internal pipeline of the electrostatic adsorption disc in the subsequent removal process does not drip out through the circulating liquid through hole, and the purpose of preventing the circulating liquid from leaking is achieved. Finally, the dirt wiping action after removal and the time required for removing the adsorption disc can be greatly reduced, the replacement efficiency is improved, the concentration of total volatile organic compounds in the air around the device can be prevented from being increased, the deployment cost and replacement cost of the organic matter filter are reduced, and the maintenance period of the filter is prolonged. The increase of metal loss defects can be effectively prevented, and the high yield of final wafer products is ensured.

Description

technical field [0001] The invention belongs to the field of wafer process equipment, and in particular relates to an electrostatic adsorption plate for preventing circulation liquid leakage. Background technique [0002] In wafer processing equipment, the electrostatic chuck (E-chuck) is an important part for wafer fixing and temperature control. It absorbs and fixes the wafer through the electrostatic force generated by the insulating layer, and passes through the insulating layer The cooling gas in the channel and the constant-temperature circulating liquid in the disk keep the wafer surface stable at the set temperature. Since the wafer temperature is an important factor affecting the etching rate and uniformity (the chemical reaction in etching is very sensitive to temperature, and a small temperature difference may cause a large etching deviation), a good etching effect requires the wafer With stable and uniform temperature distribution. Although the outer surface of...

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Problems solved by technology

[0005] In order to solve the problem that the existing electrostatic adsorption plate is easy to cause the internal circulation liquid to drop out when it is removed, which will increase the concentration of total volatile organic compounds in the air around the equipment, lead to the increase of metal loss defects and affect the wafer yield. The purpose of the invention is to provide a new type of electrostatic adsorption disc that prevents the leakage of circulating fluid

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