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High multilayer board back drilling hole interlayer depth testing structure and method

A technology for depth testing and testing structures, which is applied in the field of circuit boards, and can solve problems such as the difficulty of accurately controlling the requirements for drilling to the specified target layer, lack of depth control functions, and inability to directly observe the depth.

Active Publication Date: 2021-05-14
TIANJIN PRINTRONICS CIRCUIT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Because the ordinary drilling rig takes the table as the zero point, and controls the drilling depth by setting the height Z value between the drill tip and the table, it does not have the depth control function of drilling from the surface, so the requirements for drilling to the specified target layer are very high. It is difficult to control accurately, and because the back-drilled hole is not drilled through, the depth after drilling cannot be directly observed, and the position of the back-drilled hole and the target layer can only be detected by slicing and destroying the PCB board

Method used

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  • High multilayer board back drilling hole interlayer depth testing structure and method
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  • High multilayer board back drilling hole interlayer depth testing structure and method

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Embodiment Construction

[0023] In order to better understand the present invention, the present invention will be further described below in conjunction with specific embodiments and accompanying drawings.

[0024] The present invention provides a test structure for interlayer depth of back-drilled holes in high-layer boards. The test structure includes:

[0025] at least one first test line at the same height as the target layer; and

[0026] A second test line flush with the first adjacent layer adjacent to the target layer on one side of the electrical performance requirement layer;

[0027] The first test line and the second test line are intersected.

[0028] like figure 1 As shown, in a specific embodiment of the present invention, the high multi-layer board 10 includes a multi-layer metal layer 101 and a metal hole 102, and the hole wall of the metal hole 102 will form a copper layer 103 during the copper deposition process; a part of The copper layer 103 is used to realize the conduction b...

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Abstract

The invention provides a high multilayer board back drilling hole interlayer depth testing structure and method. The testing structure comprises at least one first testing line with the height flush with the height of a target layer; and a second test line arranged on one side of the electrical property demand layer and flush with the first adjacent layer adjacent to the target layer. According to the invention, the test lines are arranged, and the drilling depth is tested through the on-off of the test lines, so that the accurate control of the back drilling depth is realized.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a structure and method for testing the interlayer depth of a back-drilled hole of a high-layer board. Background technique [0002] With the continuous advancement of modern communication technology, PCB continues to develop in the direction of high multilayer, high thickness, and large size, that is, to high multilayer circuit boards, high multilayer circuit boards for high-speed signal transmission, and to meet impedance matching and other issues , it is necessary to achieve mutual conduction between different layers, and this kind of high-level multi-layer board cannot make metallized blind holes through the method of laser blind holes and electroplating filling holes due to its thick board thickness. However, with the development of CNC drilling machine technology Progressive, depth-controlled back-drilling technology can well meet this requirement. Back drilling refe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B7/26H05K1/02H05K3/00
CPCG01B7/26H05K1/0268H05K3/0008H05K3/0047
Inventor 龚磊吴云鹏
Owner TIANJIN PRINTRONICS CIRCUIT CORP