Chip testing method based on ceramic slide glass
A technology of chip testing and chip loading, which is applied in the direction of electronic circuit testing, measuring electronics, measuring devices, etc., can solve the problems of no screening method, inconvenient implementation and popularization, and high precision requirements for fixture design, so as to facilitate engineering The effect of the application
Pending Publication Date: 2021-05-14
CHINA ELECTRONICS TECH GRP CORP NO 14 RES INST
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Problems solved by technology
Some of the existing technologies and documents provide the packaging and manufacturing process of the bare chip, but do not provide a screening method; damage; or it is proposed to improve the reliability of the bare chip from the design guarantee and process guarantee, but the test and aging screening of all assessment items cannot be carried out on the bare chip; or the bare chip fixture system and carrier can be used to test the bare chip and Aging screening, but the precision of fixture design is high, especially the non-destructive electrical connection bump technology is not convenient to implement and popularize, and the cost is high
Method used
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Embodiment Construction
[0012] In the following, the technical solution of the present invention will be described in detail by taking a certain pulse width modulation bare chip as an example in conjunction with the accompanying drawings.
[0013] The material with good thermal conductivity is the substrate of the ceramic carrier 1, such as figure 1 As shown, the thickness is about 0.5mm, including the bonding pad 2, the welding pad 7 and the surface mount pad 6.
[0014] The size of the ceramic carrier 1 is consistent with the mounting application size of the bare chip 5 including the bonding area, such as figure 2 As shown, the welding pad 7 matches the pad of the bare chip 5, and the bare chip 5 is mounted on the ceramic carrier 1 through the welding pad 7, which is equivalent to an uncapped finished device, and the test method is similar to that of the finished device. The composite plate 2 corresponds to the lead-out point of the input and output signals of the bare chip 5 .
[0015] The bare...
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Abstract
The invention discloses a chip testing method based on a ceramic slide glass.The ceramic slide glass of which the size is consistent with the mounting application size of a bonding area of a bare chip, a welding pad is arranged on the ceramic slide glass, the bare chip is mounted on the ceramic slide glass, a surface mounting pad is arranged on the ceramic slide glass, the ceramic slide glass is fixed on a circuit board, signals of the bare chip are connected to the ceramic slide glass, the ceramic slide glass is electrically connected with the circuit board, a test fixture is designed according to pin definition of the ceramic slide glass and a conventional scheme, the test fixture is connected with a test system, the bare chip and the ceramic slide glass are used as a whole, the bare chip is not contacted, the electrical performance of the ceramic slide glass is tested, the test fixture is convenient to design, the bare chips are convenient to transfer, the surfaces of the bare chips are not damaged, all functions and performances of the bare chips can be tested, aging screening examination is carried out, defective chips are removed in an early stage, and reliability evaluation of the bare chips is completed.
Description
technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, and in particular relates to a chip testing technology. Background technique [0002] With the development of military product technology, the electronic system of aerospace weaponry is gradually developing in the direction of miniaturization, integration, and high reliability, which puts forward the application requirements for miniaturized multi-chip modules and hybrid integrated circuits. Multi-chip modules and hybrid integrated circuits have achieved rapid development due to their design flexibility, miniaturization, light weight, and high reliability, and have been widely used in aviation and aerospace vehicles. Both multi-chip modules and hybrid integrated circuits need to use a large number of bare chips. Due to the limitations of bare chip screening technology, equipment, cost, cycle and other factors, only a simple mid-test is carried out before the bare chip is insta...
Claims
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IPC IPC(8): G01R31/28
CPCG01R31/2893
Inventor 朱永亮王淑惠华明谢宁林幼权
Owner CHINA ELECTRONICS TECH GRP CORP NO 14 RES INST