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Semiconductor wafer outer wall cleaning device and method based on reciprocating telescopic movement

A technology for cleaning devices and semiconductors, which is applied in the directions of cleaning methods using liquids, cleaning methods using tools, cleaning methods and utensils, etc., and can solve the problems such as the decrease in the cleanliness of the wafer surface, the introduction of contamination on the wafer surface, and the inability to be cleaned.

Active Publication Date: 2021-05-14
JIANGSU ASIA ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the wafer manufacturing process, for example, deposition, plasma etching, photolithography, electroplating, etc., may introduce contamination and / or particles on the wafer surface, resulting in a decrease in the cleanliness of the wafer surface. The yield rate of semiconductor devices is not high, therefore, it is necessary to clean the outer wall of the wafer. The existing cleaning method usually fixes both sides of the wafer with a fixing device, but the wafer is in contact with the fixing device. Parts of the wafer cannot be cleaned, resulting in the need to manually clean the part of the wafer that is in contact with the fixture after cleaning, thereby increasing the cleaning time of the wafer

Method used

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  • Semiconductor wafer outer wall cleaning device and method based on reciprocating telescopic movement
  • Semiconductor wafer outer wall cleaning device and method based on reciprocating telescopic movement
  • Semiconductor wafer outer wall cleaning device and method based on reciprocating telescopic movement

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Experimental program
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Embodiment 1

[0056] see Figure 1-Figure 10 As shown, one of the purposes of this embodiment is to provide a semiconductor wafer outer wall cleaning device based on reciprocating lifting and contracting, including a scouring device 100 and a cleaning device 200 installed above the scouring device 100, and the scouring device 100 includes a mounting table 110, a storage Water tank 120 and installation box 130, water storage tank 120 is fixed on one end of installation platform 110 tops, water pump 121 is installed on the top of water storage tank 120, installation box 130 is installed on the side of installation platform 110 top and is positioned at water storage tank 120, installation box 130 The inner wall of the side is connected with a connecting column 131, and a flow cavity is provided in the connecting column 131. One end of the connecting column 131 is connected with a nozzle 132, and the water storage tank 120, the water pump 121 and the connecting column 131 are connected to each o...

Embodiment 2

[0075] In order to improve the degree of cleanliness of the wafer, the following improvements are made on the basis of Embodiment 1:

[0076] see figure 2 , Figure 11 and Figure 12 As shown, one end of the connecting column 131 is connected with the inner wall of the installation box 130 through a rotating block 250, and the other end of the connecting column 131 is provided with a rotating shaft 251, and the outer wall of the rotating shaft 251 is rotatably connected with a swivel 252, and the swivel 252 is connected to the brush 226 are fixedly connected by the connecting rod 253, and the swivel 252 is driven by the movement of the brush 226, and the swivel 252 drives the connecting column 131, and the connecting column 131 is rotated by the rotating block 250, so that the nozzle 132 can be used for different parts of the wafer. rinse.

Embodiment 3

[0078] In order to fix wafers of different sizes, the following improvements are made on the basis of Embodiment 1:

[0079] see Figure 6 and Figure 13As shown: the surface of the fixed table 214 is provided with a fixed disk 260, and the bottom of the fixed disk 260 is fixedly connected with an insertion rod 261. It communicates with another part of the through hole 215, and the fixed plate 260 is plugged into the surface of the fixed table 214, so that the fixed plate 260 can fix smaller wafers, thereby improving the use scene of the device.

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PUM

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Abstract

The invention relates to a cleaning device, in particular to a semiconductor wafer outer wall cleaning device and method based on reciprocating telescopic movement. The semiconductor wafer outer wall cleaning device comprises a flushing apparatus and a cleaning apparatus installed above the flushing apparatus, the flushing apparatus comprises an installation table, a water storage tank and an installation box, and the water storage tank is fixed to one end of the top of the installation table, according to the semiconductor wafer outer wall cleaning device and water purification method, a negative pressure machine and a fixed table are disposed, the wafer can be fixed under negative pressure, so that the outer wall of the wafer can be completely cleaned, and the problem that the contact part of the wafer and a fixing apparatus of an existing device cannot be cleaned, so that the contact part of the wafer and the fixing apparatus needs to be manually cleaned after cleaning is completed, and the cleaning time of the wafer is further prolonged is solved.

Description

technical field [0001] The invention relates to a cleaning device, in particular to a cleaning device and method for the outer wall of a semiconductor wafer based on reciprocating lifting and shrinking. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. At present, domestic wafer production lines are mainly 8-inch and 12-inch. [0003] During the wafer manufacturing process, for example, deposition, plasma etching, photolithography, electroplating, etc., may introduce contamination and / or particles on the wafer surface, resulting in a decrease in the cleanliness of the wafer surface. The yield rate of semiconductor devices is not high. Therefore, the outer wall of the wafer needs to be cleaned. The existing cleaning method usually fixes both sides of the wafer with a fixing device, bu...

Claims

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Application Information

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IPC IPC(8): H01L21/67B08B3/02B08B3/14B08B1/02B08B13/00
CPCH01L21/67023H01L21/67046H01L21/67051B08B3/022B08B3/14B08B13/00B08B1/20B08B1/143
Inventor 钱诚李刚童建
Owner JIANGSU ASIA ELECTRONICS TECH CO LTD