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Printed circuit board (PCB) bottom plate printing method

A printing method and backplane technology, applied in the field of PCB manufacturing, can solve problems such as scrap, reduce scrap rate, ensure product yield, and improve quality.

Pending Publication Date: 2021-05-18
惠州市大亚湾科翔科技电路板有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The embodiment of the present application provides a PCB bottom plate printing method, and solves the problem of scrapping the PCB bottom plate due to scratches by adding a new process before solder mask printing, thereby ensuring product yield, reducing production costs, and greatly reducing the scrap rate. Improve quality

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  • Printed circuit board (PCB) bottom plate printing method

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Embodiment

[0018] In order to facilitate those skilled in the art to understand the present invention, the present invention will be further described in detail below in conjunction with specific embodiments and accompanying drawings.

[0019] A method for printing a PCB bottom plate, comprising the following steps before solder mask printing:

[0020] S1 pre-soldering treatment: remove the oxide layer, oil stains, fingerprints and other dirt on the board surface, the processing line speed is 3M / S, which can increase the contact area between the solder resist ink and the board surface, making it stronger;

[0021] S2 printing: 120T screen empty screen is used for printing, photosensitive black ink with a viscosity of 120-150IV is used for printing, the ink is left for 20 minutes, and the wet weight is controlled at 1.0-1.5g;

[0022] S3 pre-baking: use 20min*70℃ for pre-baking, in order to reduce the internal stress in the board and reduce the expansion and contraction deformation of the...

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Abstract

The invention discloses a printed circuit board (PCB) bottom board printing method, which comprises the following steps of S1, solder resist pretreatment: the treatment line speed is 3M / S; S2, printing: photosensitive black ink with the viscosity of 120-150 IV is used for printing; S3, pre-baking: pre-baking is performed at 70 DEG C for 20 minutes; S4, exposure: a region which contains a circuit, a bonding pad and a large copper surface in the PCB bottom plate and is integrally enlarged by 2mil are taken as a first region, a region except the first region is taken as a second region, the negative film is exposed in the second region, and it is ensured that the first region is not covered by the ink after the ink in the second region is photo-cured; S5, developing: the first region of the unreacted ink is washed off by using a developing solution, and a second region subjected to photosensitive polymerization is left; S6, detecting: it is detected whether the PCB bottom plate is qualified or not; and S7, board baking: the PCB bottom board is baked when the PCB bottom board is detected to be qualified, and by adding a process before solder resist printing, the problem that the PCB bottom board is scraped and is scrapped is solved, so that the product yield is ensured, the production cost is reduced, the rejection rate is greatly reduced, and the quality is improved.

Description

technical field [0001] The invention belongs to the technical field of PCB manufacturing, and in particular relates to a method for printing a PCB bottom plate. Background technique [0002] For military and automotive electronic products with embedded high-frequency materials, customers have extremely strict requirements on appearance. Slight discoloration and scratches on the base material are not acceptable. For factories, this kind of harsh Appearance requirements will lead to a large number of PCB products with qualified electrical performance and good reliability being rejected and scrapped, resulting in high production costs and low yields. Contents of the invention [0003] The embodiment of the present application provides a PCB bottom plate printing method, and solves the problem of scrapping the PCB bottom plate due to scratches by adding a new process before solder mask printing, thereby ensuring product yield, reducing production costs, and greatly reducing th...

Claims

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Application Information

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IPC IPC(8): H05K3/26H05K3/06
CPCH05K3/26H05K3/065
Inventor 冯娇娇周刚张富治
Owner 惠州市大亚湾科翔科技电路板有限公司
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