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A low-damage processing method based on the principle of synergy between sapphire crystal orientation and processing direction

A processing method and technology of processing direction, applied in the direction of stone processing equipment, manufacturing tools, fine working devices, etc., can solve the problems of high hardness of sapphire material, high brittle processing surface is easy to be damaged, etc., and achieve the improvement of sapphire grinding surface Quality, reduction probability, effect of reduction of grinding forces

Active Publication Date: 2022-03-25
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Claims
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Problems solved by technology

At present, high-quality and low-damage processing technology has become a hot spot and difficulty in the manufacture of sapphire parts. The main reason is that the high hardness and high brittleness of sapphire materials make the processed surface prone to damage.

Method used

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  • A low-damage processing method based on the principle of synergy between sapphire crystal orientation and processing direction
  • A low-damage processing method based on the principle of synergy between sapphire crystal orientation and processing direction
  • A low-damage processing method based on the principle of synergy between sapphire crystal orientation and processing direction

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in specific embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] A low-damage processing method for coordinating a processing direction and a sapphire crystal orientation, the sapphire is an A-face sapphire and / or an M-face sapphire, and the processing method comprises the following steps:

[0023] Step S1. Before the sapphire is processed, use an X-ray crystal orientation instrument to orient the sapphire, and the orientation error is less than 30", the spatial positions of the A surface, the M surface, and the C surface of the sapphire and the schematic diagram of cutting the sapphir...

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Abstract

The present invention discloses a low-damage processing method based on the principle of synergy between sapphire crystal orientation and processing direction, comprising the following steps: Step S1, before processing the sapphire, use an X-ray crystal orientation instrument to orient the sapphire; Step S2 , the sapphire is clamped on the CNC precision grinder, and the axial direction of the grinding wheel in the CNC precision grinder is set to be parallel to the c-axis direction of the sapphire; Step S3, programming processing parameters, using the CNC precision grinder Sapphire is processed, wherein the M-plane sapphire is ground along the a-axis direction by the grinding wheel, and the A-plane sapphire is ground along the m-axis direction. The selected machining direction in the present invention helps to reduce the grinding force, reduces the possibility of abrasive particles falling off, and helps to improve the surface quality of sapphire grinding, especially for large-size sapphire and groove structure manufacturing technology. significance.

Description

technical field [0001] The invention belongs to the technical field of sapphire processing and manufacturing, and mainly relates to a low-damage processing method based on the principle of synergy between sapphire crystal orientation and processing direction. Background technique [0002] Sapphire material has good optical properties, physical properties, and high melting point. Shows good stability under extreme environmental conditions. With the development and maturity of crystal growth technology for sapphire materials, sapphire materials are more and more widely used in semiconductors, optical windows and other fields. Due to the particularity of sapphire application fields, there are high requirements for the surface quality of sapphire parts. At present, high-quality and low-damage processing technology has become a hot spot and difficulty in the manufacture of sapphire parts. The main reason is that the high hardness and high brittleness of sapphire materials make ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/00B24B1/00
CPCB28D5/00B24B1/00
Inventor 梁志强王银惠周天丰王西彬杨海成张云龙苏瑛郭芮冯博雅周磊
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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