Multi-purpose heat dissipation shielding anti-static structure for electronic product device

Abstract

The invention discloses a multi-purpose heat dissipation shielding anti-static structure for an electronic product device; the structure comprises an electronic product mainboard, a heating element, an easy-to-radiate element, an easy-to-interfere element, a support frame B and a heat dissipation shielding plate A. The heating element, the easy-to-radiate element and the easy-to-interfere element are arranged on the front surface of the electronic product mainboard, and the electronic product mainboard is grounded. The support frame B is arranged on the front face of the electronic product mainboard, and the heat dissipation shielding plate A covers the support frame B. The heating element, the easy-to-radiate element and the easy-to-interfere element are arranged in the coverage area of the heat dissipation shielding plate A. The beneficial effects are that shielding of signal radiation and electrostatic protection of elements in the internal space are facilitated; the structure is convenient to produce and maintain, good in heat dissipation effect on main heating elements in the inner space, high in cost performance and high in practical value.

Description

technical field [0001] The invention relates to the technical field of heat dissipation and electrostatic shielding, in particular to a multipurpose heat dissipation shielding antistatic structure for electronic product devices. Background technique [0002] With the continuous increase of functions and performance of electronic products in today's society, the continuous increase of its power consumption leads to the continuous increase of its power consumption. As the temperature of electronic components increases, its performance will decline. In order to maintain the performance of electronic components at a high level , Electronic products are heat dissipation problems and need to be continuously optimized. In addition, when the components such as CPU and DDR are running, they will also radiate energy, which sometimes easily interferes with the radio frequency components running on the same electronic product motherboard, so it is also necessary to do a good job of shie...

AI Technical Summary

Problems solved by technology

[0003] Insufficiency of the existing technology, the current practice is generally that a motherboard has multiple heat dissipation devices and shielding devices, so disassembly and assembly in the production and maintenance process is also more troublesome, because the heat dissipation device and shielding device are separated separately, the The sealing performance is not very good, and the shielding effect is not very good, and sometimes static electricity is easy to enter through these gaps, which will affect the normal operation of electronic products and even damage their functions.

Images