Controllable heat dissipation system and controllable heat dissipation method based on semiconductor refrigeration

Abstract

The invention discloses a controllable heat dissipation system and controllable heat dissipation method based on semiconductor refrigeration; the system comprises a circuit board box and further comprises a control panel, heat conduction silica gel, a thermoelectric semiconductor, cooling fins and a fan; the control panel is installed in the circuit board box, the bottom face of the thermoelectric semiconductor and the top face of the circuit board box are pasted through the heat conduction silica gel. The top surface of the thermoelectric semiconductor is adhered to the bottom surface of the cooling fin through the heat conduction silica gel; the fan is mounted on the top surfaces of the cooling fins; the control panel comprises a logic chip, a driver, a microcontroller, a relay, a temperature sensor, a 3.3 V power supply and a 12V power supply; according to the design, cooling can be timely and rapidly carried out, the on-line and off-line temperature can be set according to requirements, energy conservation and environmental protection are achieved, and the thermoelectric semiconductor pasted with the heat conduction silica gel makes contact with the plate box to achieve rapid cooling; the working temperature of refrigeration can be set, and the thermoelectric semiconductor is controllable.

Description

technical field [0001] The invention relates to the field of circuit board heat dissipation, in particular to a controllable heat dissipation system and a controllable heat dissipation method based on semiconductor refrigeration. Background technique [0002] Printed circuit boards in military and aerospace products are basically packaged in metal plate boxes, and the temperature on the circuit board and inside the box also increases during work. Solving the heat dissipation problem of the circuit board has become a top priority. Heavy. At present, there are two commonly used heat dissipation methods for circuit boards. The method is based on using a fan to blow directly to the heating surface to increase air flow and achieve active heat dissipation; the other is based on attaching heat sinks to heat-generating electronic components to increase the contact area with the air Achieve passive cooling. [0003] Since the circuit board is contained in the metal plate box, it is...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is aimed at the technical problem that the heat dissipation effect of the circuit board in military and aerospace equipment is general, and it is impossible to achieve real-time rapid cooling. The purpose is to provide a controllable heat dissipation system and a controllable heat dissipation method based on semiconductor refrigeration. Through active heat dissipation Combined with passive cooling for rapid cooling

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