Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for testing I-type fracture toughness of bonding interface of composite material bonding structure

A technology of fracture toughness and structural adhesive, which is applied in the field of testing the type I fracture toughness of the bonding interface, which can solve problems such as difficult test operations, and achieve the effects of strong controllability, convenient operation, and improved accuracy

Active Publication Date: 2021-06-04
北京市科学技术研究院分析测试研究所(北京市理化分析测试中心)
View PDF12 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned problems, the present invention provides a method for testing the type I fracture toughness of the bonded interface of fiber reinforced composite materials, which solves the difficulty in the test operation of the type I fracture toughness. Through this method, the whole process can be automatically Record the position of the interface debonding crack tip, collect it synchronously with the microcomputer-controlled universal testing machine, calculate the energy release rate corresponding to each moment, and extract the critical energy release rate (fracture toughness G IC ), which can effectively analyze the crack growth mechanism and improve the accuracy of crack tip location

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for testing I-type fracture toughness of bonding interface of composite material bonding structure
  • Method for testing I-type fracture toughness of bonding interface of composite material bonding structure
  • Method for testing I-type fracture toughness of bonding interface of composite material bonding structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0051] The present invention will be described in detail below by way of examples. The embodiments are only used to illustrate the content of the present invention and are not limited thereto. Those skilled in the art, due to the technical inspiration involved in the present invention, adopt equivalent replacements or equivalent deformations to form technical solutions that fall within the scope of the present invention within the scope of protection.

[0052] The present invention will be further described below in conjunction with the specific implementation process.

[0053] 1. Sample preparation

[0054] Such as figure 1 As shown, the geometric dimensions of the sample are 140mm long and 25mm wide. The composite material is AGMP3516 / T700, the adhesive is AGMA 020 adhesive, and the layup of the upper and lower composite material laminates is 16 layers, and the laying method is [0 / 45 / 90 / -45 / 0 / 45 / 90 / -45 / -45 / 90 / 45 / 0 / -45 / 90 / 45 / 0], the layup of the adhesive surface is 0°. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for testing I-type fracture toughness of bonding interface of composite material bonding structure. The method comprises the following steps: 1) preparing a sample; 2) measuring the size of the sample; 3) preparing speckles on the surface of the sample; 4) installing a sample, adjusting a digital image test system, and completing camera focusing; 5) loading the sample; 6) performing data extraction; and 7) performing data analysis and result calculation. The method solves the problem that the I-type fracture toughness test is difficult to operate, can automatically record the position of the tip of the interface debonding crack in the whole process, synchronously acquires and calculates the energy release rate corresponding to each moment and extracts the critical energy release rate (fracture toughness GIC) with a microcomputer-controlled universal testing machine, and can effectively carry out crack propagation mechanism analysis, and therefore, the accuracy of crack tip positioning is improved.

Description

technical field [0001] The invention relates to the field of experimental mechanics of fiber-reinforced composite materials, and more specifically relates to a method for testing the type I fracture toughness of the bonding interface of fiber-reinforced composite material bonding structures based on digital image correlation (DIC). Background technique [0002] Fiber-reinforced composite structure is an advanced material with high specific strength, high specific stiffness, strong designability and wide application. In order to realize the application of this material in large-scale structures, it is necessary to combine small elements into large structural parts by means of connections. Mechanical connection technology is a commonly used method in metal structures, which requires drilling holes in the surface of the structure. For long-fiber reinforced composite laminates, due to their structural characteristics, new damage is easily introduced after punching, but the bond...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01N3/08G01N3/06G01N19/04
CPCG01N3/08G01N3/068G01N19/04G01N2203/0017G01N2203/0067G01N2203/0066G01N2203/0647G01N2203/0682G01N2203/0676
Inventor 郭霞倪虹贺俊智刘伟丽胡光辉张梅高峡
Owner 北京市科学技术研究院分析测试研究所(北京市理化分析测试中心)
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com