Unlock instant, AI-driven research and patent intelligence for your innovation.

Manufacturing method of circuit board solder mask layer and circuit board

A manufacturing method and solder resist layer technology, which is applied in printed circuit manufacturing, printed circuit, secondary treatment of printed circuit, etc., can solve problems such as excessive side erosion of circuit boards, shedding of solder resist bridges, etc., and achieve improved roughness and improved Adhesion, degree reduction effect

Inactive Publication Date: 2021-06-04
SHENNAN CIRCUITS
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This application mainly provides a method for making the solder resist layer of a circuit board and a circuit board to solve the problem that the solder resist bridge falls off due to excessive side erosion of the circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of circuit board solder mask layer and circuit board
  • Manufacturing method of circuit board solder mask layer and circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0028] The terms "first", "second", and "third" in the embodiments of the present application are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, features defined as "first", "second", and "third" may explicitly or implicitly include at least one of these features. In the description of the present application, "p...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a manufacturing method of a circuit board solder mask layer and a circuit board. The manufacturing method of the circuit board solder mask comprises the following steps: providing a substrate; carrying out super roughening treatment on the substrate; forming a solder mask layer on the substrate; performing exposure treatment on the solder mask layer; carrying out developing treatment on the solder mask layer after exposure treatment; and curing the solder mask layer. According to the substrate provided by the invention, the adhesive force between the surface of the substrate and the solder mask layer can be improved by carrying out super-roughening treatment on the provided substrate, so the degree of developing lateral erosion and the risk of falling off of the solder mask bridge can be reduced.

Description

technical field [0001] The present application relates to the technical field of circuit board production technology, in particular to a method for manufacturing a solder resist layer of a circuit board and a circuit board. Background technique [0002] The printed circuit board (Printed Circuit Board, PCB) is composed of an insulating substrate, connecting wires and pads for welding electronic components. Instead of complex wiring, reduce the workload in the traditional way, simplify the assembly, welding and debugging of electronic products, reduce the volume of the whole machine, reduce product costs, improve the quality and reliability of electronic equipment, printed circuit boards have good product consistency , it can adopt a standardized design. [0003] After the outer layer of the printed circuit board is fabricated, it is usually coated with a layer of solder resist ink to prevent problems such as short circuit, oxidation and insulation of the circuit caused by t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/28
CPCH05K3/282H05K2203/11
Inventor 王永来郑礼青余晋磊
Owner SHENNAN CIRCUITS