A hybrid integrated circuit fixed structure for rotary vacuum vapor phase cleaning

A hybrid integrated circuit and fixed structure technology, applied in secondary processing of printed circuits, assembling printed circuits with electrical components, cleaning/polishing of conductive patterns, etc., to achieve the effect of improving fixability, ensuring stability, and avoiding circuit fixation problems

Active Publication Date: 2022-03-22
XIAN MICROELECTRONICS TECH INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the problem that hybrid integrated circuits cannot be fixed during rotary vacuum vapor phase cleaning in the prior art, the present invention provides a hybrid integrated circuit fixing structure for rotary vacuum vapor phase cleaning. The fixing structure is simple, easy to use, and universal Strong, meet the fixing of hybrid integrated circuits and movable components of different shapes and sizes, suitable for hybrid integrated circuits of different sizes and specifications, solve the problem of circuit fixing in the process of vacuum vapor phase cleaning of hybrid integrated circuits, and meet the needs of high reliability circuits The need for vacuum vapor cleaning

Method used

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  • A hybrid integrated circuit fixed structure for rotary vacuum vapor phase cleaning
  • A hybrid integrated circuit fixed structure for rotary vacuum vapor phase cleaning
  • A hybrid integrated circuit fixed structure for rotary vacuum vapor phase cleaning

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Embodiment Construction

[0032] The present invention will be further described in detail below in conjunction with specific embodiments, which are explanations of the present invention rather than limitations.

[0033] The invention provides a hybrid integrated circuit fixing structure for rotary vacuum vapor phase cleaning, such as figure 1 and figure 2 As shown, it includes a circuit case 5, a frame body 7, and several beams 1 and pressing blocks 3; the two ends of several beams 1 are respectively fixed on the frame body 7, and the circuit case 5 is in the shape of a hybrid integrated circuit. It is fixed inside the circuit case 5, and the two sides of the bottom of the circuit case 5 are placed on the beam wall of the adjacent beam 1. The inside of the circuit case 5 is exposed to the outside, and several pressing blocks 3 are fixedly connected to the beam 1. And the two sides of the briquetting block 3 are respectively pressed on the two sides of the top of the circuit case 5 to realize the fix...

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Abstract

The invention provides a hybrid integrated circuit fixing structure for rotary vacuum vapor phase cleaning. Several beams are fixedly arranged on the frame body. The two sides are placed on the beam wall of the adjacent beam, and the inside of the circuit shell is exposed to the outside, which is convenient for vacuum vapor phase cleaning in the circuit shell. On both sides of the top of the circuit housing, the stability of the circuit housing on the beam is improved, effectively avoiding the problem of circuit fixing during vacuum vapor phase cleaning, and ensuring the stability of the hybrid integrated circuit when rotating during vacuum vapor phase cleaning sex.

Description

technical field [0001] The invention relates to the technical field of hybrid integrated circuit assembly, in particular to a hybrid integrated circuit fixing structure for rotary vacuum vapor phase cleaning. Background technique [0002] For fully sealed hybrid integrated circuits, the cleanliness inside the circuit is an important factor affecting the quality of the circuit. Due to the particularity of the soldering process (including reflow soldering and manual soldering), flux is needed to assist in soldering to ensure the reliability of solder joints. Flux contamination after soldering is an unavoidable type of contamination in the production process control. It can only be removed by a cleaning process to ensure the reliability of the circuit. [0003] The vacuum vapor phase cleaning process can effectively reduce the surface tension of the solvent, improve the fine-pitch cleaning ability, and ensure the effectiveness of post-soldering cleaning of hybrid integrated ci...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34H05K3/26
CPCH05K3/34H05K3/26
Inventor 叶晓飞马雄飞黄栋吕晓云张军李卫卫周乐
Owner XIAN MICROELECTRONICS TECH INST
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