A dynamic thermal radiation cooling device based on phase change material vanadium dioxide

A vanadium dioxide and refrigeration device technology, applied in the field of heat radiation, can solve problems such as weak refrigeration capacity, achieve the effects of improving adhesion, solving the problem of excessive refrigeration, and having a simple structure

Active Publication Date: 2022-03-15
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Problems solved by technology

[0008] In view of the above-mentioned problems or deficiencies, in order to solve the problem of weak refrigeration capacity of current radiant refrigeration devices

Method used

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  • A dynamic thermal radiation cooling device based on phase change material vanadium dioxide
  • A dynamic thermal radiation cooling device based on phase change material vanadium dioxide
  • A dynamic thermal radiation cooling device based on phase change material vanadium dioxide

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Embodiment Construction

[0030] The present invention will be further elaborated below in conjunction with the embodiments and accompanying drawings.

[0031] A dynamic thermal radiation refrigeration device based on the phase change material vanadium dioxide, the preparation method of which is as follows:

[0032] Step 1, depositing (including but not limited to thermal evaporation) a layer of metal reflective layer (silver) and a layer of low refractive index medium layer (CaF 2 ).

[0033] Step 2, growing a transition dielectric layer (silicon dioxide) by sputtering or other methods to increase the adhesion of vanadium dioxide.

[0034] Step 3, preparing vanadium dioxide periodic arrays, including:

[0035] Method 1: After deposition of vanadium dioxide and annealing, photolithography is used to form a patterned disc columnar photoresist array on the surface of the vanadium dioxide film, and then the vanadium dioxide film is etched into a periodic disc structure by etching, and finally The photo...

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Abstract

The invention belongs to the technical field of heat radiation, in particular to a dynamic heat radiation cooling device based on phase change material vanadium dioxide. The present invention is based on the classic metal-dielectric-metal metasurface structure design, introduces a transition medium layer to effectively improve the adhesion of the vanadium dioxide film of the phase change material, and regulates the entire device and the blackbody radiation rate at room temperature through the selection of the medium layer material. The corresponding peak value effectively solves the technical problem that the cooling effect of the current thermal radiation cooling device is relatively poor. The present invention radiates energy through the mid-infrared 8-14μm atmospheric window when the temperature is high, and reflects sunlight, but hardly radiates energy when the temperature is low, achieving the functions of intelligent temperature control and dynamic refrigeration; it has intelligent dynamic control temperature, simple structure, convenient for large-area preparation, zero energy consumption, and polarization insensitivity; it is of great significance to solve the problem of excessive cooling and alleviate the urban heat island effect, and it also has application potential in infrared camouflage and other fields.

Description

technical field [0001] The invention belongs to the technical field of heat radiation, and in particular relates to a dynamic heat radiation cooling device based on a phase-change material vanadium dioxide. Background technique [0002] With the increase of urbanization rate, the heat island effect intensifies, and the annual energy consumption for cooling increases sharply. The traditional refrigeration method uses heat convection and heat conduction to cool, which has the disadvantages of high energy consumption, pollution and release of greenhouse gases. Utilizing these methods can intensify the heat island effect on the other hand and create a vicious circle. How to break such a vicious circle is a major challenge facing mankind at present. [0003] Radiant cooling is a form of heat transfer that enables cooling with zero energy consumption and zero emissions, without the need for electricity, refrigerants, or moving parts. And the heat radiation method is to dissipat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/08C23C14/06C23C14/14C23C14/24C23C14/34C23C14/58F25B23/00
CPCC23C14/083C23C14/14C23C14/0694C23C14/24C23C14/34C23C14/5873F25B23/003Y02A30/60
Inventor 毕磊彭征康同同秦俊邓龙江
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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