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Power conversion device

A technology for power conversion devices and mounting components, which is applied to output power conversion devices, circuit devices, printed circuit grounding devices, etc. Substrate cost, heat generation suppression, and effects of improved noise resistance

Active Publication Date: 2021-06-08
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In addition, in the existing circuit module, at least one side of the odd-shaped component needs to be fixed to the heat sink or the like. In addition, the fixing method to the heat sink is difficult due to the number and shape of the odd-shaped component. There are problems in the mounting structure of parts such that, in the case where tensile force is transmitted from the outside to the insulating substrate, etc., the screw will be damaged or the odd-shaped part will be deformed, and the odd-shaped part itself will be peeled off from the heat sink
In addition, there is a problem that it is difficult to place adjacent to a circuit board on which control power semiconductors and general electronic parts of odd-shaped parts are mounted.
In addition, there is a problem that it is difficult to fix the circuit module and the heat sink, etc.

Method used

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Experimental program
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Embodiment approach 1

[0026] figure 1 It is a sectional view showing the configuration of the main circuit of the power conversion device according to the first embodiment. figure 2 It is a circuit diagram showing the configuration of the main circuit of the power conversion device. image 3 yes figure 1 A partial enlargement of area A of .

[0027] Such as figure 1 As shown, the main circuit 101 of the power conversion device according to Embodiment 1 is configured to include: a substrate 10; a first wiring layer 21 and a second wiring layer 22 provided on both sides of the substrate 10; The first GND layer 23 and the second GND layer 24 which are arranged on the inner layer part of the substrate 10 under the layer 22 respectively; part 19; a lead insertion part 20 arranged on the surface of the substrate 10 and connected to the first wiring layer 21 and the second wiring layer 22; and a cooler (or case) 28 through which The mounting screw 25 is attached to a through hole 26 as a first throu...

Embodiment approach 2

[0048] In Embodiment 1, a case where wiring layers and GND layers are a four-layer substrate is shown, but in Embodiment 2, a case where wiring layers and GND layers are a six-layer substrate will be described.

[0049] Figure 5 It is a sectional view showing the configuration of the main circuit of the power conversion device according to the second embodiment. Figure 6 yes Figure 5 A partial enlargement of region D of . Such as Figure 5 and Figure 6 As shown in FIG. figure 1 21, Figure 5 , Figure 6 21a) between the first GND layer 23 and the second wiring layer ( figure 1 22, Figure 5 , Figure 6 22a) and the second GND layer 24 are respectively provided with a third wiring layer ( Figure 5 , Figure 6 21b) with the fourth wiring layer ( Figure 5 , Figure 6 22b). Other configurations of the main circuit 102 of the power conversion device according to the second embodiment are the same as those of the main circuit 101 of the power conversion device ac...

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Abstract

A power conversion device includes: a main circuit (101) having first and second wiring layers (21, 22) formed respectively on both surfaces of a base board (10), mounted parts (19, 20) mounted on the first and second wiring layers, and first and second GND layers (23, 24) formed respectively, between external- and internal-layer portions (10a, 10b, 10c) of the base board and in regions corresponding to the mounted parts each being a mounted part which forms a circuit other than a circuit having an inductance component as a lumped constant, and to the first and second wiring layers; and a cooler (28) attached to the base board by means of fixing screws through a first through-hole (26) created in an end portion of the board; wherein the first and second GND layers are each formed so that creepage distance is created around a second through-hole in which a lead insertion part (20) that mutually connects the first and second wiring layers is inserted.

Description

technical field [0001] The present invention relates to power conversion devices. Background technique [0002] Conventionally, in multilayer printed wiring boards used in power conversion devices, AC (Alternating Current: Alternating Current) / DC (Direct Current: Direct Current) converters, DC / DC converters, inverters, etc. When flowing through the wiring layer on the substrate, in order to suppress it within the allowable current determined by the glass transition temperature of the substrate, it can be dealt with by increasing the copper foil thickness of the wiring layer, increasing the number of wiring layers on the substrate, and reducing the wiring impedance. Alternatively, a structure for directly or indirectly cooling the wiring layer is provided to form a heat path and take measures against heat dissipation. [0003] On the other hand, as noise countermeasures, it is necessary to install cross-line capacitors (hereinafter referred to as X capacitors), linear capaci...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M1/00H05K7/20
CPCH02M1/00H05K7/20918H01L23/4006H01L23/49822H01L23/50H02M3/003H02M1/44H02M1/327H02M3/28H02M1/123H05K2201/10409H05K2201/10166H05K2201/10181H05K1/116H05K2201/09718H05K2201/0761H05K2201/0723H05K1/0218H05K3/306H05K2201/066H05K7/209H05K3/429H05K1/0215H05K7/20436H05K3/46H05K3/32H02M7/003H01L23/3675H01L2023/4018
Inventor 高木俊和
Owner MITSUBISHI ELECTRIC CORP
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