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Novel LED chip mass sorting method

A technology of LED chips and LED substrates, applied in sorting, semiconductor/solid-state device testing/measurement, electrical components, etc., can solve problems such as low efficiency and time-consuming, improve production efficiency, save probe displacement and The effect of the timing of the test

Pending Publication Date: 2021-06-11
吉安市木林森显示器件有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention solves the technical problems of time-consuming and low efficiency of the current sorting and testing method for chips. The present invention provides a new type of massive sorting method for LED chips with simple structure and reasonable design.

Method used

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  • Novel LED chip mass sorting method
  • Novel LED chip mass sorting method
  • Novel LED chip mass sorting method

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Embodiment Construction

[0032] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0033] When ordinal numerals such as "first" and "second" are mentioned in the embodiments of the present invention, unless they really express the meaning of sequence according to the context, it should be understood that they are only used for distinction.

[0034] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, Or integrally connected; it may be ...

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Abstract

The invention discloses a novel LED chip mass sorting method. The method comprises the following steps of S1, carrying out installation, specifically, installing an LED substrate containing chips on a test fixture; S2, carrying out testing, specifically, adopting a scanning test mode to perform a lightening test on the chips in a test area; S3, carrying out recording, specifically, storing lightening data generated during the lightening test; S4, carrying out analysis, importing the lightening data into an information processing system and comparing the lightening data with standard data, and then confirming difference point chips and the position coordinates of the difference point chips; S5, carrying out cutting, specifically, cutting the LED substrate; S6, carrying out testing, specifically, according to the position coordinates of the difference point chips, testing the cut difference point chips in a single-chip lightening mode; S7, carrying out removal; and S8, carrying out grading and classification. The chips are tested and sorted through the steps, and compared with the mode of lightening the chips one by one or testing multiple chips at the same time, the method has the advantages that the probe displacement and test time is greatly shortened, and the production efficiency is improved.

Description

【Technical field】 [0001] The invention relates to the technical field of LED chips, in particular to a novel method for sorting large quantities of LED chips. 【Background technique】 [0002] As people's requirements for high-definition display screens are getting higher and higher, small-pitch display screen products are developing rapidly. For example, Mini-LED adopts LED chip size of micron level, and there are usually thousands of chips on each Mini-LED circuit board, and display color difference has always been a major problem in LED display packaging. To solve this problem, first of all, it is necessary to strictly control the chip feeding, and screen out the chips with very concentrated photoelectric characteristics for filing and feeding. [0003] However, the chip sorting technology currently used by LED chip manufacturers has the following main processes: point measurement, AOI detection, manual detection, Sorter, inverted film, and classification and filing. Usua...

Claims

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Application Information

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IPC IPC(8): B07C5/344B07C5/02H01L33/00H01L21/66
CPCB07C5/344B07C5/02H01L33/0095H01L22/14H01L22/20
Inventor 刘勇华李秦豫
Owner 吉安市木林森显示器件有限公司
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