PNL cutting and splicing process capable of improving utilization rate of substrate

A utilization rate and substrate technology, applied in the field of PNL board cutting and assembling process, can solve the problems of poor oiling, large area and inconvenient production, and achieve the effect of improving production efficiency, enhancing market competitiveness, and high utilization rate of plates

Pending Publication Date: 2021-06-15
益阳市明正宏电子有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This process can effectively improve the utilization rate of the board, reduce the production cost of the PNL board, improve the production efficiency of the PNL board, and at the same time solve the problems of inconvenient production due to the large area of ​​a single PNL in the carbon oil printing process, and there are problems such as poor oiling and misalignment.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • PNL cutting and splicing process capable of improving utilization rate of substrate
  • PNL cutting and splicing process capable of improving utilization rate of substrate
  • PNL cutting and splicing process capable of improving utilization rate of substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] (7) if Figure 3-4 As shown, a PNL board cutting and jigsaw process for improving the substrate utilization rate of the present invention adopts a substrate size of 2184×1245mm, and uses a diamond cutting knife with a knife width of 3mm to divide the substrate size of 2184×1245mm into two rows Three rows of six A areas with a size of 726×621mm are used for material cutting; specifically, the size between two A areas with a size of 726×621mm is 3mm, and then the diamond cutting knife with a knife width of 3mm is just cut. A substrate with a size of 2184×1245mm is cut into two rows and three columns of six A regions with a size of 726×621mm.

[0037] Taking the A area with a size of 726×621mm as an example, make an imposition of the A area with a size of 726×621mm, specifically, divide the A area with a size of 726×621mm into two columns and two B with a size of 621×363mm Area, and use a gong knife with a knife width of 1.5mm to divide the A area with a size of 726×621mm...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a PNL cutting and splicing process capable of improving the utilization rate of a substrate. The PNL cutting and splicing process comprises the steps of: 1, adopting a substrate with the size being 2184*1245 mm, and using a thin diamond cutter to divide the substrate with the size being 2184*1245 mm into six regions A with the size being 726*621 mm in two rows and three columns by cutting and slicing; 2, after cutting and slicing, further cutting each region A with the size of 726*621 mm into two columns of regions B with the size of 621*363 mm through using an end mill, and printing carbon oil on the cut regions B; and 3, milling each region B printed with the carbon oil into seven PNLs with the size of 116.5*241.2 mm in three rows and three columns through using a milling cutter, and trimming the PNLs. Therefore, compared with an existing cutting technology, the overall efficiency and the panel utilization rate are higher, due to the sizes of the PNLs, while the product and customer requirements are met, the production cost is reduced, the production efficiency is improved, the market competitiveness is comprehensively improved, resource waste is reduced, and clean production and environmental protection requirements are met.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, and in particular relates to a PNL board cutting and splicing process for improving substrate utilization. Background technique [0002] In the process of circuit board production, the main factors affecting the cost are: 1. Plate cost; 2. Drilling cost; 3. Process cost; 4. Management costs such as artificial water and electricity. Among these factors, the board cost accounts for 60%-80% of the cost of producing circuit boards, so how to make better use of the boards in production and increase the utilization rate of the boards to the highest point determines the price of the circuit boards. The trend; the price also determines the order quantity. It can be seen that making good use of the board is the most important thing in the production of circuit boards. [0003] In general, the design information provided by customers is a single unit board or continuous board. Because the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/00
CPCH05K3/0052
Inventor 赵孟瑜祝文华黄扬波陈泽和邬家康
Owner 益阳市明正宏电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products