PNL cutting and splicing process capable of improving utilization rate of substrate

A utilization rate and substrate technology, applied in the field of PNL board cutting and assembling process, can solve the problems of poor oiling, large area and inconvenient production, and achieve the effect of improving production efficiency, enhancing market competitiveness, and high utilization rate of plates
CN112969294APending Publication Date: 2021-06-15益阳市明正宏电子有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
益阳市明正宏电子有限公司
Publication Date
2021-06-15

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Abstract

The invention discloses a PNL cutting and splicing process capable of improving the utilization rate of a substrate. The PNL cutting and splicing process comprises the steps of: 1, adopting a substrate with the size being 2184*1245 mm, and using a thin diamond cutter to divide the substrate with the size being 2184*1245 mm into six regions A with the size being 726*621 mm in two rows and three columns by cutting and slicing; 2, after cutting and slicing, further cutting each region A with the size of 726*621 mm into two columns of regions B with the size of 621*363 mm through using an end mill, and printing carbon oil on the cut regions B; and 3, milling each region B printed with the carbon oil into seven PNLs with the size of 116.5*241.2 mm in three rows and three columns through using a milling cutter, and trimming the PNLs. Therefore, compared with an existing cutting technology, the overall efficiency and the panel utilization rate are higher, due to the sizes of the PNLs, while the product and customer requirements are met, the production cost is reduced, the production efficiency is improved, the market competitiveness is comprehensively improved, resource waste is reduced, and clean production and environmental protection requirements are met.
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Description

technical field

[0001] The invention belongs to the technical field of circuit board production, and in particular relates to a PNL board cutting and splicing process for improving substrate utilization. Background technique

[0002] In the process of circuit board production, the main factors affecting the cost are: 1. Plate cost; 2. Drilling cost; 3. Process cost; 4. Management costs such as artificial water and electricity. Among these factors, the board cost accounts for 60%-80% of the cost of producing circuit boards, so how to make better use of the boards in production and increase the utilization rate of the boards to the highest point determines the price of the circuit boards. The trend; the price also determines the order quantity. It can be seen that making good use of the board is the most important thing in the production of circuit boards.

[0003] In general, the design information provided by customers is a single unit board or continuous board. Because the...

Claims

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