soi wafer quality inspection method and system
A quality inspection method and wafer technology, applied in photovoltaic system monitoring, semiconductor/solid-state device testing/measurement, sustainable manufacturing/processing, etc., can solve problems such as non-destructive inspection of SOI wafer quality, and achieve The effect of non-destructive evaluation
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Embodiment 1
[0037] see Figure 1 to Figure 5 , the present embodiment provides a SOI wafer quality detection method, which is characterized in that it includes the following steps:
[0038] 1) Provide an SOI wafer, the SOI wafer includes a substrate layer 101, a buried oxide layer 102 and a semiconductor layer 103 stacked in sequence; the semiconductor layer 103 includes a first doped layer 103a and a second doped layer 103 stacked in sequence Impurity layer 103b;
[0039] 2) placing a first pressure probe 104 and a second pressure probe 105 with an interval on the surface of the semiconductor layer 103;
[0040] 3) grounding the first pressure probe 104, applying a constant first voltage to the second pressure probe 105, applying a changing second voltage to the substrate layer 101, and collecting the second pressure probe 105 first current data corresponding to different second voltages;
[0041] 4) Extract the test surface mobility according to the different second voltages and the ...
Embodiment 2
[0074] like Image 6 As shown, this embodiment provides an SOI wafer quality inspection system, which is characterized in that it includes:
[0075]The current and voltage test module 107 is used to perform current and voltage tests on the SOI wafer; the SOI wafer includes a substrate layer 101, a buried oxide layer 102 and a semiconductor layer 103 stacked in sequence; the semiconductor layer 103 includes a sequence of The stacked first doped layer 103a and the second doped layer 103b; the first pressure probe 104 and the second pressure probe 105 are placed on the surface of the semiconductor layer 103 with an interval distance; the first pressure probe The needle 104 is grounded, the current and voltage test module 107 applies a constant first voltage to the second pressure probe 105, and applies a variable second voltage to the substrate layer 101;
[0076] The data collection and determination module 108 collects the first current data corresponding to different second v...
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Abstract
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