Conductive sputter targets with silicon, zirconium and oxygen
A sputtering and resistivity technology, which is applied in sputtering coating, circuit, zirconia, etc., can solve the problems of affecting the sputtering rate along the target tube, affecting the uniformity of plasma density, and expensive radio frequency sputtering equipment. Effects of reduced arcing, lower resistivity, and higher conductivity
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[0040] The present invention will be described with respect to particular embodiments and with reference to certain drawings but the invention is not limited thereto but only by the claims. The dimensions and relative dimensions do not correspond to actual reductions for practicing the invention.
[0041] In the description and claims, the terms first, second, etc. are used to distinguish similar elements and not necessarily to describe an order in time, space, hierarchy or any other manner. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the invention described herein are capable of operation in other sequences than described or illustrated herein.
[0042] Furthermore, the terms top, bottom, etc. in the description and claims are used for descriptive purposes and not necessarily for describing relative positions. It is to be understood that the terms so used are interchangeable under appropriate c...
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