A kind of parylene F-type vapor deposition method
A vapor deposition, stage technology, applied in metal material coating process, vacuum evaporation plating, coating and other directions, can solve the problems of unstable evaporation rate, low deposition efficiency, performance waste, etc., to reduce the difficulty of film thickness control, Excellent purification performance and the effect of improving processing efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0027] A Parylene F-type vapor deposition method, comprising the following steps:
[0028] 1. Gasification and evaporation:
[0029] (1) The base pressure before the temperature of 90°C is set to 0.1torr, and after reaching 90°C, the pressure is reduced to 0.04torr, and the temperature rises from 80°C at the same time, and the heating rate is adjusted according to the three temperature stages;
[0030] (2) Heating rate adjustment:
[0031] The first temperature stage: when the temperature is 80℃~90℃, the heating rate is 1℃ / 10min, and the pressure is 0.1torr;
[0032] The second temperature stage: when the temperature is 90℃~120℃, the heating rate is 1℃ / 30min, and the pressure is 0.04torr
[0033] The third temperature stage: when the temperature is >120°C, the heating rate is 1°C / 20min, and the pressure gradually decreases.
[0034] 2. Cracking: cracking is carried out at a temperature of 750°C.
[0035] 3. Deposition polymerization: The gaseous reactive monomer is deposit...
Embodiment 2
[0037] A Parylene F-type vapor deposition method, comprising the following steps:
[0038] 1. Gasification and evaporation:
[0039] (1) The base pressure before the temperature of 90°C is set to 0.1torr, and after reaching 90°C, the pressure is reduced to 0.03torr, and the temperature rises from 80°C at the same time, and the heating rate is adjusted according to the three temperature stages;
[0040] (2) Heating rate adjustment:
[0041] The first temperature stage: when the temperature is 80℃~90℃, the heating rate is 1℃ / 10min, and the pressure is 0.1torr;
[0042] The second temperature stage: when the temperature is 90℃~120℃, the heating rate is 1℃ / 30min, and the pressure is 0.03torr;
[0043] The third temperature stage: when the temperature is >120°C, the heating rate is 1°C / 20min, and the pressure gradually decreases.
[0044] 2. Cracking: cracking is carried out at a temperature of 745°C.
[0045] 3. Deposition polymerization: The gaseous reactive monomer is deposi...
Embodiment 3
[0047] A Parylene F-type vapor deposition method, comprising the following steps:
[0048] 1. Gasification and evaporation:
[0049] (1) The base pressure before the temperature of 90°C is set to 0.1torr, and after reaching 90°C, the pressure is reduced to 0.05torr, and the temperature rises from 80°C at the same time, and the heating rate is adjusted according to the three temperature stages;
[0050] (2) Heating rate adjustment:
[0051] The first temperature stage: when the temperature is 80℃~90℃, the heating rate is 1℃ / 10min, and the pressure is 0.1torr;
[0052] The second temperature stage: when the temperature is 90℃~120℃, the heating rate is 1℃ / 30min, and the pressure is 0.05torr;
[0053] The third temperature stage: when the temperature is >120°C, the heating rate is 1°C / 20min, and the pressure gradually decreases.
[0054] 2. Cracking: cracking is carried out at a temperature of 750°C.
[0055] 3. Deposition polymerization: The gaseous reactive monomer is deposi...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com